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239-75AB Datasheet(PDF) 11 Page - List of Unclassifed Manufacturers |
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239-75AB Datasheet(HTML) 11 Page - List of Unclassifed Manufacturers |
11 / 20 page Board Level Heat Sinks All other products, please contact factory for price, delivery, and minimums. Normally stocked 40 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 250 SERIES High-Performance Slim Profile Heat Sinks With Integral Clips Multiwatt Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 250-122AB 1.220 (31.0) 1.000 (25.4) x .500 (12.7) Vert./Horiz. No Tab Clip 50°C @ 4W 3.7°C/W @ 400 LFM 250-122AB-09 1.220 (31.0) 1.000 (25.4) x .500 (12.7) Vertical 09 Clip 50°C @ 4W 3.7°C/W @ 400 LFM 250-122AB-25 1.380 (35.1) 1.000 (25.4) x .500 (12.7) Vertical 25 Clip 50°C @ 4W 3.7°C/W @ 400 LFM Material: Aluminum, Black Anodized Dimensions: in. (mm) MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 250-122AB 250-122AB-09 250-122AB-25 250 SERIES 237 AND 252 SERIES High-Performance, High-Power Vertical Mount Heat Sinks TO-220 Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection 237-167AB2 1.675 (42.5) 1.000 (25-4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 46° C @ 4W 4.5° C/W @ 200 LFM 237-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 46° C @ 4W 4.5° C/W @ 200 LFM 237-167AB2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 46° C @ 4W 4.5° C/W @ 200 LFM 252-167AB2 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 40° C @ 4W 4.5° C/W @ 200 LFM 252-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 40° C @ 4W 4.5° C/W @ 200 LFM 252-167AB2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 40° C @ 4W 4.5° C/W @ 200 LFM Order SpeedClips™ 285SC or 330SC separately for rapid component installation, lowering manufacturing costs. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 227-167 237-167AB3 252-167AB3 237-167AB3 252-167 237-167AB2 252-167AB2 237-167AB2-24 252-167AB2-24 237 AND 252 SERIES 237 AND 252 SERIES Dimensions: in. (mm) 252-167AB3 291 SERIES Labor-Saving Clip-on Heat Sinks TO-220 Vertical Height Above Mounting Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Natural Forced Weight P/N in. (mm) in. (mm) Style Convection Convection lbs. (grams) 291-C236AB 0.860 (21.)9 1.100 (27.0) x 0.360 (9.1) TO-220 (Clip) 80° C @ 2W 24°C/W @ 600 LFM 0.0026 (1.18) 291-H36AB 0.860 (21.9) 1.100 (27.0) x 0.360 (9.1) TO-220 (Mtg. Hole) 68° C @ 2W 16°C/W @ 600 LFM 0.0026 (1.18)) Material: Aluminum, Black Anodized Designed for mounting horizontally or vertically on a circuit board, 291 Series heat sinks employ a unique clip for attachment of TO-220 case styles. One type is available with a locking clip and one with a 0.140 in. (3.6) diameter mounting hole only. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 291 SERIES Dimensions: in. (mm) 291-C2 291-H |
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