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233-60AB-01 Datasheet(PDF) 11 Page - List of Unclassifed Manufacturers

Part # 233-60AB-01
Description  BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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233-60AB-01 Datasheet(HTML) 11 Page - List of Unclassifed Manufacturers

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Board Level
Heat Sinks
All other products, please contact factory for price, delivery, and minimums.
Normally stocked
40
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
250 SERIES
High-Performance Slim Profile Heat Sinks With Integral Clips
Multiwatt
Height Above
Footprint
Thermal Performance at Typical Load
Standard
PC Board
Dimensions
Mounting
Solderable
Mounting
Natural
Forced
P/N
in. (mm)
in. (mm)
Configuration
Tab Options
Style
Convection
Convection
250-122AB
1.220 (31.0)
1.000 (25.4) x .500 (12.7)
Vert./Horiz.
No Tab
Clip
50°C @ 4W
3.7°C/W @ 400 LFM
250-122AB-09
1.220 (31.0)
1.000 (25.4) x .500 (12.7)
Vertical
09
Clip
50°C @ 4W
3.7°C/W @ 400 LFM
250-122AB-25
1.380 (35.1)
1.000 (25.4) x .500 (12.7)
Vertical
25
Clip
50°C @ 4W
3.7°C/W @ 400 LFM
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
250-122AB
250-122AB-09
250-122AB-25
250 SERIES
237 AND 252 SERIES
High-Performance, High-Power Vertical Mount Heat Sinks
TO-220
Height Above
Footprint
Thermal Performance at Typical Load
Standard
PC Board
Dimensions
Mounting
Solderable
Mounting
Natural
Forced
P/N
in. (mm)
in. (mm)
Configuration
Tab Options
Style
Convection
Convection
237-167AB2
1.675 (42.5)
1.000 (25-4) x 1.000 (25.4)
Vertical
2, Twisted
Clip/Mtg Slot
46° C @ 4W
4.5° C/W @ 200 LFM
237-167AB3
1.675 (42.5)
1.000 (25.4) x 1.000 (25.4)
Vertical
3, Twisted
Clip/Mtg Slot
46° C @ 4W
4.5° C/W @ 200 LFM
237-167AB2-24
1.675 (42.5)
1.000 (25.4) x 1.000 (25.4)
Vertical
2, Solderable
Clip/Mtg Slot
46° C @ 4W
4.5° C/W @ 200 LFM
252-167AB2
1.675 (42.5)
1.000 (25.4) x 1.000 (25.4)
Vertical
2, Twisted
Clip/Mtg Slot
40° C @ 4W
4.5° C/W @ 200 LFM
252-167AB3
1.675 (42.5)
1.000 (25.4) x 1.000 (25.4)
Vertical
3, Twisted
Clip/Mtg Slot
40° C @ 4W
4.5° C/W @ 200 LFM
252-167AB2-24
1.675 (42.5)
1.000 (25.4) x 1.000 (25.4)
Vertical
2, Solderable
Clip/Mtg Slot
40° C @ 4W
4.5° C/W @ 200 LFM
Order SpeedClips™ 285SC or 330SC separately for rapid component installation, lowering manufacturing costs. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
227-167
237-167AB3
252-167AB3
237-167AB3
252-167
237-167AB2
252-167AB2
237-167AB2-24
252-167AB2-24
237 AND 252 SERIES
237 AND 252 SERIES
Dimensions: in. (mm)
252-167AB3
291 SERIES
Labor-Saving Clip-on Heat Sinks
TO-220
Vertical
Height Above
Mounting Footprint
Thermal Performance at Typical Load
Standard
PC Board
Dimensions
Mounting
Natural
Forced
Weight
P/N
in. (mm)
in. (mm)
Style
Convection
Convection
lbs. (grams)
291-C236AB
0.860 (21.)9
1.100 (27.0) x 0.360 (9.1)
TO-220 (Clip)
80° C @ 2W
24°C/W @ 600 LFM
0.0026 (1.18)
291-H36AB
0.860 (21.9)
1.100 (27.0) x 0.360 (9.1)
TO-220 (Mtg. Hole)
68° C @ 2W
16°C/W @ 600 LFM
0.0026 (1.18))
Material: Aluminum, Black Anodized
Designed for mounting horizontally or vertically on a circuit board, 291 Series heat sinks
employ a unique clip for attachment of TO-220 case styles.
One type is available with a locking clip and one with a 0.140 in. (3.6) diameter mounting
hole only.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
291 SERIES
Dimensions: in. (mm)
291-C2
291-H


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