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HIP2100

100V/2A Peak, Low Cost, High Frequency

Half Bridge Driver

The HIP2100 is a high frequency, 100V Half Bridge

N-Channel power MOSFET driver IC. The low-side and

high-side gate drivers are independently controlled and

matched to 8ns. This gives the user maximum flexibility in

dead-time selection and driver protocol. Undervoltage

protection on both the low-side and high-side supplies force

the outputs low. An on-chip diode eliminates the discrete

diode required with other driver ICs. A new level-shifter

topology yields the low-power benefits of pulsed operation

with the safety of DC operation. Unlike some competitors,

the high-side output returns to its correct state after a

momentary undervoltage of the high-side supply.

Features

• Drives N-Channel MOSFET Half Bridge

• SOIC, EPSOIC, QFN and DFN Package Options

• SOIC, EPSOIC and DFN Packages Compliant with 100V

Conductor Spacing Guidelines of IPC-2221

• Pb-Free Product Available (RoHS Compliant)

• Bootstrap Supply Max Voltage to 114VDC

• On-Chip 1

Ω Bootstrap Diode

• Fast Propagation Times for Multi-MHz Circuits

• Drives 1000pF Load with Rise and Fall Times Typ. 10ns

• CMOS Input Thresholds for Improved Noise Immunity

• Independent Inputs for Non-Half Bridge Topologies

• No Start-Up Problems

• Outputs Unaffected by Supply Glitches, HS Ringing Below

Ground, or HS Slewing at High dv/dt

• Low Power Consumption

• Wide Supply Range

• Supply Undervoltage Protection

•3

Ω Driver Output Resistance

• QFN/DFN Package:

- Compliant to JEDEC PUB95 MO-220

QFN - Quad Flat No Leads - Package Outline

- Near Chip Scale Package Footprint, which Improves

PCB Efficiency and has a Thinner Profile

Applications

• Telecom Half Bridge Power Supplies

• Avionics DC/DC Converters

• Two-Switch Forward Converters

• Active Clamp Forward Converters

Ordering Information

PART

NUMBER

(Note 1)

PART

MARKING

TEMP.

RANGE

(°C)

PACKAGE

PKG.

DWG. #

HIP2100IB

2100 IB

-40 to +125 8 Ld SOIC

M8.15

HIP2100IBZ

(Note 2)

2100 IBZ

-40 to +125 8 Ld SOIC

(Pb-free)

M8.15

HIP2100EIBZ

(Note 2)

2100 EIBZ

-40 to +125 8 Ld EPSOIC

(Pb-free)

M8.15C

HIP2100IRZ

(Note 2)

HIP 2100IRZ

-40 to +125 16 Ld 5x5 QFN

(Pb-free)

L16.5x5

HIP2100IR4Z

(Note 2)

21 00IR4Z

-40 to +125 12 Ld 4x4 DFN

(Pb-free)

L12.4x4A

NOTES:

1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on

reel specifications.

2. These Intersil Pb-free plastic packaged products employ special Pb-

free material sets, molding compounds/die attach materials, and

100% matte tin plate plus anneal (e3 termination finish, which is

RoHS compliant and compatible with both SnPb and Pb-free

soldering operations). Intersil Pb-free products are MSL classified

at Pb-free peak reflow temperatures that meet or exceed the Pb-

free requirements of IPC/JEDEC J STD-020.

Data Sheet

April 2, 2010

FN4022.14