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TLV1117-15IDCYG3 Datasheet(PDF) 5 Page - Texas Instruments |
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TLV1117-15IDCYG3 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 36 page TLV1117 www.ti.com SLVS561K – DECEMBER 2004 – REVISED APRIL 2013 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN Continuous input voltage 16 V TJ Operating virtual-junction temperature 150 °C Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION TLV1117 PowerFlex THERMAL METRIC(1)(2)(3) UNITS KTE KTP DRJ DCY KVU KCS/KCT KTT (3 PINS) (3 PINS) (8 PINS) (4 PINS) (3 PINS) (3 PINS) (3 PINS) θJA Junction-to-ambient thermal resistance 38.6 49.2 38.3 104.3 50.9 30.1 27.5 θJCtop Junction-to-case (top) thermal 34.7 60.6 36.5 53.7 57.9 44.6 43.2 resistance θJB Junction-to-board thermal resistance 3.2 3.1 60.5 5.7 34.8 1.2 17.3 ψJT Junction-to-top characterization 5.9 8.7 0.2 3.1 6 5 2.8 parameter °C/W Junction-to-board characterization ψJB 3.1 3 12 5.5 23.7 1.2 9.3 parameter Junction-to-case (bottom) thermal θJCbot 3 3 4.7 n/a 0.4 0.4 0.3 resistance Thermal resistance between the die θJP junction and the bottom of the exposed 2.7 1.4 1.78 n/a n/a 3 1.94 pad. (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator. (3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. RECOMMENDED OPERATING CONDITIONS MIN(1) MAX UNIT TLV1117 2.7 15 TLV1117-15 2.9 15 TLV1117-18 3.2 15 VIN Input voltage V TLV1117-25 3.9 15 TLV1117-33 4.7 15 TLV1117-50 6.4 15 IO Output current 0.8 A TLV1117C 0 125 TJ Operating virtual-junction temperature °C TLV1117I –40 125 (1) The input-to-output differential across the regulator should provide for some margin against regulator operation at the maximum dropout (for a particular current value). This margin is needed to account for tolerances in both the input voltage (lower limit) and the output voltage (upper limit). The absolute minimum VIN for a desired maximum output current can be calculated by the following: VIN(min) = VOUT(max) + VDO(max at rated current) Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TLV1117 |
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