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SM72238TDE-3.3 Datasheet(PDF) 2 Page - Texas Instruments |
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SM72238TDE-3.3 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 17 page SM72238 SNVS694C – JANUARY 2011 – REVISED APRIL 2013 www.ti.com Connection Diagrams Front View Figure 2. PFM Package See Package Number NDP0003B These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Input Supply Voltage −0.3 to +30V Power Dissipation Internally Limited Junction Temperature (TJ) +150°C Ambient Storage Temperature −65° to +150°C Soldering Dwell Time, Temperature Wave 4 seconds, 260°C Infrared 10 seconds, 240°C Vapor Phase 75 seconds, 219°C ESD Rating Human Body Model(3) 2500V (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test conditions, see the Electrical Characteristics tables. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) Human Body Model 1.5k Ω in series with 100pF. Operating Ratings (1) Maximum Input Supply Voltage 30V Junction Temperature Range, (TJ) (2) −40° to +125°C (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test conditions, see the Electrical Characteristics tables. (2) Junction-to-case thermal resistance for the PFM package is 5.4°C/W. 2 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: SM72238 |
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