SN65HVD72

SN65HVD75

SN65HVD78

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SLLSE11C – MARCH 2012 – REVISED SEPTEMBER 2013

ABSOLUTE MAXIMUM RATINGS

(1)

VALUE

UNIT

MIN

MAX

–0.5

5.5

V

Voltage range at A or B Inputs

–13

16.5

V

Input voltage range at any logic pin

–0.3

5.7

V

Voltage input range, transient pulse, A and B, through 100

Ω

–100

100

V

Receiver Output Current

–24

24

mA

170

°C

Storage Temperature,

-65

150

°C

Continuous total power dissipation

See the Thermal Characteristics table

±12

kV

IEC 61000-4-2 ESD (Contact Discharge), bus terminals and GND

±12

kV

IEC 61000-4-4 EFT (Fast transient or burst) bus terminals and GND

±4

kV

IEC 60749-26 ESD (Human Body Model), bus terminals and GND

±15

kV

JEDEC Standard 22, Test Method A114 (Human Body Model), all pins

±8

kV

JEDEC Standard 22, Test Method C101 (Charged Device Model), all pins

±1.5

kV

JEDEC Standard 22, Test Method A115 (Machine Model), all pins

±300

V

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

By inference from contact discharge results, see the Application Information section

RECOMMENDED OPERATING CONDITIONS

MIN

NOM MAX

UNIT

Supply voltage

3

3.3

3.6

V

–7

12

V

High-level input voltage (Driver, driver enable, and receiver enable inputs)

2

V

Low-level input voltage (Driver, driver enable, and receiver enable inputs)

0

0.8

V

Differential input voltage

–12

12

V

Output current, Driver

–60

60

mA

Output current, Receiver

–8

8

mA

Differential load resistance

54

60

Ω

Differential load capacitance

50

pF

HVD72

250

kbps

Signaling rate

HVD75

20

Mbps

HVD78

50

Mbps

(2)

Operating free-air temperature (See the application section for thermal information)

–40

125

°C

Junction Temperature

–40

150

°C

(1)

The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.

(2)

Operation is specified for internal (junction) temperatures up to 150°C. Self-heating due to internal power dissipation should be

considered for each application. Maximum junction temperature is internally limited by the thermal shut-down (TSD) circuit which

disables the driver outputs when the junction temperature reaches 170°C.

Copyright © 2012–2013, Texas Instruments Incorporated

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