NCV7719

http://onsemi.com

5

Rating

Symbol

Value

Unit

VSx Pin Voltage

(VS1, VS2)

(DC)

(AC), t < 500 ms, Ivsx > −2 A

VSxdcMax

VSxac

−0.3 to 40

−1.0

V

I/O Pin Voltage

( Vcc, SI, SCLK, CSB, SO, EN)

VioMax

−0.3 to 5.5

V

OUTx Pin Voltage

(DC)

(AC)

(AC), t< 500 ms, IOUTx > −1.1 A

(AC), t< 500 ms, IOUTx < 1 A

VoutxDc

VoutxAc

−0.3 to 40

−0.3 to 40

−1.0

1.0

V

OUTx Pin Current

(OUT1, ..., OUT10)

IoutxImax

−2.0 to 2.0

A

Junction Temperature Range

−40 to 150

°C

Storage Temperature Range

Tstr

−55 to 150

°C

Peak Reflow Soldering Temperature: Pb−free 60 to 150 seconds at 217

°C

(Note 1)

260

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

ATTRIBUTES

Characteristic

Symbol

Value

Unit

Short Circuit Reliability Characterization

AECQ10x

Grade A

−

ESD Capability

Human Body Model per AEC−Q100−002

VSx, OUTx

All Other Pins

Machine Model per AEC−Q100−003

Vesd4k

Vesd2k

Vesd200

≥ ±4.0 kV

≥ ±2.0 kV

≥ ±200 V

Moisture Sensitivity Level

MSL

MSL2

−

Package Thermal Resistance – Still−air

Junction–to–Ambient

(Note 2)

(Note 3)

Junction–to–Board

(Note 2)

(Note 3)

54

26

22

14

°C/W

°C/W

°C/W

°C/W

3. Based on JESD51−7, 1.2 mm thick FR4, 1S2P PCB with 2 oz. copper and 18 thermal vias to 80x80 mm 1 oz. internal spreader planes.

RECOMMENDED OPERATING CONDITIONS

Parameter

Symbol

Min

Max

Unit

Digital Supply Input Voltage

VCCOp

3.15

5.25

V

Battery Supply Input Voltage

VSxOp

5.5

28

V

DC Output Current

IxOp

−

0.55

A

Junction Temperature

TjOp

−40

125

°C

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.