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ESDAVLC8-1BU2 Datasheet(PDF) 8 Page - STMicroelectronics |
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ESDAVLC8-1BU2 Datasheet(HTML) 8 Page - STMicroelectronics |
8 / 11 page Recommendation on PCB assembly ESDAVLC8-1BU2 8/11 Doc ID 16546 Rev 2 4 Recommendation on PCB assembly 4.1 Stencil opening design Figure 15. Recommended stencil windows position 4.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed 4. Solder paste with fine particles: powder particle size is 20-45 µm. 0.425 0.20 0.038 0.065 Footprint Stencil window 0.040 0.038 0.30 0.320 0.425 1.05 0.225 |
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