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W989D6CBHX5G Datasheet(PDF) 1 Page - Winbond

Part # W989D6CBHX5G
Description  512Mb Mobile LPSDR
Download  65 Pages
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W989D6CBHX5G Datasheet(HTML) 1 Page - Winbond

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W989D6CB / W989D2CB
512Mb Mobile LPSDR
Publication Release Date : August 07, 2013
- 1 -
Revision : A01-006
1. GENERAL DESCRIPTION
The Winbond 512Mb Low Power SDRAM is a low power synchronous memory containing
536,870,912 memory cells fabricated with Winbond high performance process technology.
It is designed to consume less power than the ordinary SDRAM with low power features essential
for applications which use batteries. It is available in two organizations: 4,194,304-words × 4 banks
× 32 bits or 8,388,608 words × 4 banks × 16 bits. The device operates in a fully synchronous
mode, and the output data are synchronized to positive edges of the system clock and is capable
of delivering data at clock rate up to 166MHz. The device supports special low power functions
such as Partial Array Self Refresh (PASR) and Automatic Temperature Compensated Self Refresh
(ATCSR).
The Low Power SDRAM is suitable for 2.5G / 3G cellular phone, PDA, digital still camera, mobile
game consoles and other handheld applications where large memory density and low power
consumption are required. The device operates from 1.8V power supply, and supports the 1.8V
LVCMOS bus interface.
2. FEATURES
Power supply VDD = 1.7V~1.95V
VDDQ = 1.7V~1.95V
Frequency : 166MHz(-6),133MHz(-75)
Programmable Partial Array Self Refresh
Power Down Mode
Deep Power Down Mode (DPD)
Programmable output buffer driver strength
Automatic Temperature Compensated Self Refresh
CAS Latency: 2 and 3
Burst Length: 1, 2, 4, 8, and full page
Refresh: refresh cycle 64ms
Interface: LVCMOS
Support package :
54 balls VFBGA (x16)
90 balls VFBGA (x32)
Operating Temperature Range
Extended (-25°C ~ +85°C)
Industrial (-40°C ~ +85°C)


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