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W987D6HB Datasheet(PDF) 9 Page - Winbond

Part # W987D6HB
Description  128Mb Mobile LPSDR
Download  66 Pages
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W987D6HB Datasheet(HTML) 9 Page - Winbond

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W987D6HB / W987D2HB
128Mb Mobile LPSDR
Publication Release Date : September 25, 2013
- 9 -
Revision : A01-004
7. ELECTRICAL CHARACTERISTICS
7.1 Absolute Maximum Ratings
Parameter
Symbol
Values
Units
Min
Max
Voltage on VDD relative to VSS
VDD
−0.5
2.3
V
Voltage on VDDQ relative to VSS
VDDQ
−0.5
2.3
V
Voltage on any pin relative to VSS
VIN, VOUT
−0.5
2.3
V
Storage Temperature
TSTG
−55
150
°C
Short Circuit Output Current
IOUT
±50
mA
Power Dissipation
PD
1.0
W
Notes: stresses greater than those listed in “absolute maximum ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or any other conditions above those
indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
7.2 Operating Conditions
Parameter
Symbol
Min.
Typ
Max.
Unit
Supply Voltage
VDD
1.7
1.8
1.95
V
Supply Voltage (for I/O Buffer)
VDDQ
1.7
1.8
1.95
V
Input High level Voltage
VIH
0.8*VDDQ
-
VDDQ + 0.3
V
Input Low level Voltage
VIL
-0.3
-
+0.3
V
LVCOMS Output
HLevel Voltage (IOUT = -0.1 mA )
VOH
0.9*VDDQ
-
-
V
LVCMOS Output
LLevel Voltage (IOUT = +0.1 mA )
VOL
-
-
0.2
V
Input Leakage Current
(0V
 VIN  VDD, all other pins not under test = 0V)
II(L)
-1
-
1
A
Output Leakage Current (Output disable , 0V
 VOUT
 VDDQ)
IO(L)
-5
-
5
A
Note: VIH(max) = VDD/ VDDQ+1.2V for pulse width < 5 ns , VIL(min) = VSS/ VSSQ-1.2V for pulse width < 5 ns
7.3 Capacitance
Parameter
Symbol
Min.
Max.
Unit
Input Capacitance : All other input-only
CI
1.5
3.0
pf
Input Capacitance (CLK)
CCLK
1.5
3.5
pf
Input/Output capacitance
CIO
3.0
5.0
pf
Note: These parameters are periodically sampled and not 100% tested.


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