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AM29LV641DH120RFI Datasheet(PDF) 4 Page - Advanced Micro Devices |
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AM29LV641DH120RFI Datasheet(HTML) 4 Page - Advanced Micro Devices |
4 / 57 page September 20, 2002 Am29LV640D/Am29LV641D 3 TABLE OF CONTENTS Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5 Special Handling Instructions for FBGA/fBGA Packages ......... 8 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Ordering Information . . . . . . . . . . . . . . . . . . . . . . 10 Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 11 Table 1. Device Bus Operations .....................................................11 VersatileIO (V IO) Control ..................................................... 11 Requirements for Reading Array Data ................................... 11 Writing Commands/Command Sequences ............................ 12 Accelerated Program Operation ......................................................12 Autoselect Functions .......................................................................12 Standby Mode ........................................................................ 12 Automatic Sleep Mode ........................................................... 12 RESET#: Hardware Reset Pin ............................................... 12 Output Disable Mode .............................................................. 13 Table 2. Sector Address Table ........................................................13 Autoselect Mode ..................................................................... 17 Table 3. Autoselect Codes, (High Voltage Method) .......................17 Sector Group Protection and Unprotection ............................. 18 Table 4. Sector Group Protection/Unprotection Address Table .....18 Write Protect (WP#) ................................................................ 19 Temporary Sector Group Unprotect ....................................... 19 Figure 1. Temporary Sector Group Unprotect Operation................ 19 Figure 2. In-System Sector Group Protect/Unprotect Algorithms ... 20 SecSi (Secured Silicon) Sector Flash Memory Region .......... 21 Table 5. SecSi Sector Contents ......................................................21 Hardware Data Protection ...................................................... 21 Low VCC Write Inhibit .....................................................................21 Write Pulse “Glitch” Protection ........................................................22 Logical Inhibit ..................................................................................22 Power-Up Write Inhibit ....................................................................22 Common Flash Memory Interface (CFI) . . . . . . . 22 Table 6. CFI Query Identification String .......................................... 22 System Interface String................................................................... 23 Table 8. Device Geometry Definition .............................................. 23 Table 9. Primary Vendor-Specific Extended Query ........................ 24 Command Definitions . . . . . . . . . . . . . . . . . . . . . 24 Reading Array Data ................................................................ 24 Reset Command ..................................................................... 25 Autoselect Command Sequence ............................................ 25 Enter SecSi Sector/Exit SecSi Sector Command Sequence .. 25 Word Program Command Sequence ..................................... 25 Unlock Bypass Command Sequence ..............................................26 Figure 3. Program Operation .......................................................... 26 Chip Erase Command Sequence ........................................... 26 Sector Erase Command Sequence ........................................ 27 Erase Suspend/Erase Resume Commands ........................... 27 Figure 4. Erase Operation............................................................... 28 Command Definitions ............................................................. 29 Command Definitions...................................................................... 29 Write Operation Status . . . . . . . . . . . . . . . . . . . . . 30 DQ7: Data# Polling ................................................................. 30 Figure 5. Data# Polling Algorithm ................................................... 30 RY/BY#: Ready/Busy# ............................................................ 31 DQ6: Toggle Bit I .................................................................... 31 Figure 6. Toggle Bit Algorithm........................................................ 31 DQ2: Toggle Bit II ................................................................... 32 Reading Toggle Bits DQ6/DQ2 ............................................... 32 DQ5: Exceeded Timing Limits ................................................ 32 DQ3: Sector Erase Timer ....................................................... 32 Table 11. Write Operation Status ................................................... 33 Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34 Figure 7. Maximum Negative Overshoot Waveform ..................... 34 Figure 8. Maximum Positive Overshoot Waveform....................... 34 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35 Figure 9. I CC1 Current vs. Time (Showing Active and Automatic Sleep Currents) ........................................... 36 Figure 10. Typical I CC1 vs. Frequency ............................................ 36 Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 11. Test Setup.................................................................... 37 Table 12. Test Specifications ......................................................... 37 Key to Switching Waveforms. . . . . . . . . . . . . . . . 37 Figure 12. Input Waveforms and Measurement Levels...................................................................... 37 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38 Read-Only Operations ........................................................... 38 Figure 13. Read Operation Timings ............................................... 38 Hardware Reset (RESET#) .................................................... 39 Figure 14. Reset Timings ............................................................... 39 Erase and Program Operations .............................................. 40 Figure 15. Program Operation Timings.......................................... 41 Figure 16. Accelerated Program Timing Diagram .......................... 41 Figure 17. Chip/Sector Erase Operation Timings .......................... 42 Figure 18. Data# Polling Timings (During Embedded Algorithms)...................................................... 43 Figure 19. Toggle Bit Timings (During Embedded Algorithms)...................................................... 44 Figure 20. DQ2 vs. DQ6................................................................. 44 Temporary Sector Unprotect .................................................. 45 Figure 21. Temporary Sector Group Unprotect Timing Diagram ... 45 Figure 22. Sector Group Protect and Unprotect Timing Diagram .. 46 Alternate CE# Controlled Erase and Program Operations ..... 47 Figure 23. Alternate CE# Controlled Write (Erase/Program) Operation Timings .............................................. 48 Erase And Programming Performance . . . . . . . 49 Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 49 TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 49 Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 50 SSO056—56-Pin Shrink Small Outline Package (SSOP) ...... 50 FBE063—63-Ball Fine-Pitch Ball Grid Array (FBGA) 12 x 11 mm package ................................................. 51 LAA064—64-Ball Fortified Ball Grid Array (FBGA) 13 x 11 mm package ................................................. 52 TS 048—48-Pin Standard TSOP ............................................ 53 TSR048—48-Pin Reverse TSOP ........................................... 54 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55 |
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