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W25Q40BWSVIE Datasheet(PDF) 2 Page - Winbond |
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W25Q40BWSVIE Datasheet(HTML) 2 Page - Winbond |
2 / 73 page W25Q40BW - 2 - Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 5 2. FEATURES....................................................................................................................................... 5 3. PIN CONFIGURATION SOIC/VSOP 150-MIL ................................................................................. 6 4. PAD CONFIGURATION WSON 6X5-MM, USON 2X3-MM ............................................................. 6 5. PIN DESCRIPTION SOIC/VSOP 150-MIL, WSON 6X5-MM & USON 2X3-MM ............................. 6 5.1 Package Types..................................................................................................................... 7 5.2 Chip Select (/CS).................................................................................................................. 7 5.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 7 5.4 Write Protect (/WP)............................................................................................................... 7 5.5 HOLD (/HOLD) ..................................................................................................................... 7 5.6 Serial Clock (CLK) ................................................................................................................ 7 6. BLOCK DIAGRAM ............................................................................................................................ 8 7. FUNCTIONAL DESCRIPTION ......................................................................................................... 9 7.1 SPI OPERATIONS ............................................................................................................... 9 7.1.1 Standard SPI Instructions.......................................................................................................9 7.1.2 Dual SPI Instructions ..............................................................................................................9 7.1.3 Quad SPI Instructions ............................................................................................................9 7.1.4 Hold Function .........................................................................................................................9 7.2 WRITE PROTECTION ....................................................................................................... 10 7.2.1 Write Protect Features .........................................................................................................10 8. CONTROL AND STATUS REGISTERS ........................................................................................ 11 8.1 STATUS REGISTER .......................................................................................................... 11 8.1.1 BUSY ...................................................................................................................................11 8.1.2 Write Enable Latch (WEL) ....................................................................................................11 8.1.3 Block Protect Bits (BP2, BP1, BP0)......................................................................................11 8.1.4 Top/Bottom Block Protect (TB).............................................................................................11 8.1.5 Sector/Block Protect (SEC) ..................................................................................................11 8.1.6 Complement Protect (CMP) .................................................................................................12 8.1.7 Status Register Protect (SRP1, SRP0) ................................................................................12 8.1.8 Erase/Program Suspend Status (SUS) ................................................................................12 8.1.9 Security Register Lock Bits (LB3, LB2, LB1, LB0) ................................................................12 8.1.10 Quad Enable (QE) ..............................................................................................................13 8.1.11 Status Register Memory Protection (CMP = 0)...................................................................14 8.1.12 Status Register Memory Protection (CMP = 1)...................................................................15 8.2 INSTRUCTIONS................................................................................................................. 16 8.2.1 Manufacturer and Device Identification ................................................................................16 8.2.2 Instruction Set Table 1 (Erase, Program Instructions) (1) .......................................................17 |
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