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W25Q16DWSSIG Datasheet(PDF) 19 Page - Winbond |
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W25Q16DWSSIG Datasheet(HTML) 19 Page - Winbond |
19 / 85 page W25Q16DW Publication Release Date: September 06, 2012 - 19 - Revision F 7.2 INSTRUCTIONS The Standard/Dual/Quad SPI instruction set of the W25Q16DW consists of thirty six basic instructions that are fully controlled through the SPI bus (see Instruction Set table1-3). Instructions are initiated with the falling edge of Chip Select (/CS). The first byte of data clocked into the DI input provides the instruction code. Data on the DI input is sampled on the rising edge of clock with most significant bit (MSB) first. The QPI instruction set of the W25Q16DW consists of twenty four basic instructions that are fully controlled through the SPI bus (see Instruction Set table 4). Instructions are initiated with the falling edge of Chip Select (/CS). The first byte of data clocked through IO[3:0] pins provides the instruction code. Data on all four IO pins are sampled on the rising edge of clock with most significant bit (MSB) first. All QPI instructions, addresses, data and dummy bytes are using all four IO pins to transfer every byte of data with every two serial clocks (CLK). Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed with the rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in figures 5 through 42. All read instructions can be completed after any clocked bit. However, all instructions that Write, Program or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been clocked) otherwise the instruction will be ignored. This feature further protects the device from inadvertent writes. Additionally, while the memory is being programmed or erased, or when the Status Register is being written, all instructions except for Read Status Register will be ignored until the program or erase cycle has completed. 7.2.1 Manufacturer and Device Identification MANUFACTURER ID (MF7 - MF0) Winbond Serial Flash EFh Device ID (ID7 - ID0) (ID15 - ID0) Instruction ABh, 90h, 92h, 94h 9Fh W25Q16DW 14h 6015h |
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