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ERJ3GEYJ102V Datasheet(PDF) 1 Page - Panasonic Semiconductor |
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ERJ3GEYJ102V Datasheet(HTML) 1 Page - Panasonic Semiconductor |
1 / 2 page Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Thick Film Chip Resistors 1 2 3 4 5 6 7 8 9 10 11 12 Thick Film Chip Resistors Product Code Size, Power Rating XGN : 01005 1GN : 0201 2GE : 0402 3GE : 0603 6GE : 0805 8GE : 1206 14 : 1210 12 : 1812 12Z : 2010 1T : 2512 0.031 W 0.05 W 0.1 W 0.1 W 0.125 W 0.25 W 0.5 W 0.75 W 0.75 W 1 W Power R. Marking Code Y Nil Marking Value Marking on black side No marking Resistance Tolerance Code J 0 Tolerance ±5 % Jumper The first two digits are significant figures of resistance and the third one denotes number of zeros following. Decimal Point is expressed by R as 4.7 = 4R7. Jumper is expressed by R00. Resistance Value Packaging Methods Code Y U Packaging Type Embossed Carrier Taping W4P1, 40,000 pcs. Pressed Carrier Taping W8P2, 20,000 pcs. C Pressed Carrier Taping 2 mm pitch, 15,000 pcs. ERJXGN X Y Punched Carrier Taping 2 mm pitch, 20,000 pcs. U Embossed Carrier Taping 4 mm pitch, 5,000 pcs. Punched Carrier Taping 2 mm pitch, 10,000 pcs. ERJ2GE ERJ1GN Embossed Carrier Taping 4 mm pitch, 4,000 pcs. ERJ1T ERJ14 ERJ12 ERJ12Z Type : inch V Punched Carrier Taping 4 mm pitch, 5,000 pcs. ERJ3GE ERJ6GE ERJ8GE Thick Film Chip Resistors 01005, 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512 Type: ERJ XG, 1G, 2G, 3G, 6G, 8G, 14, 12, 12Z, 1T ■ Features ● Small size and lightweight ● High reliability Metal glaze thick film resistive element and three layers of electrodes ● Compatible with placement machines Taping packaging available ● Suitable for both reflow and flow soldering ● Reference Standards IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B ● RoHS compliant ■ Explanation of Part Numbers ● ERJXGN, 1GN, 2GE, 3GE, 6GE, 8GE, 14, 12, 12Z, 1T Series, ±5 % type ✽ When omitted, the rest of the P/N factors shall be moved up respectively. (Only XGN, 1GN, 2GE type) ■ Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions Please see Data Files Aug. 2012 02 3 |
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