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TISP4S088M3BJR-S Datasheet(PDF) 6 Page - Bourns Electronic Solutions |
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TISP4S088M3BJR-S Datasheet(HTML) 6 Page - Bourns Electronic Solutions |
6 / 7 page JUNE 2012 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TISP4SxxxBJ Overvoltage Protector Series Package Outline Dimensions This surface mount two terminal package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound is designed to withstand normal soldering temperatures with no deformation and circuit performance characteristics will remain stable when operated in most high humidity conditions. Terminals require no additional cleaning or processing when used in soldered assembly. SMB (DO-214AA) Package MILLIMETERS (INCHES) DIMENSIONS ARE : 0.203 (0.008) MAX. 0.152 - 0.305 (0.006 - 0.012) 2.13 - 2.44 (0.084 - 0.096) 0.76 - 1.52 (0.030 - 0.060) 5.21 - 5.59 (0.220 - 0.205) 3.30 - 3.94 (0.130 - 0.155) 4.06 - 4.57 (0.160 - 0.180) 1.95 - 2.20 (0.077 - 0.086) Recommended Printed Wiring Land Pattern Dimensions 2.54 (.100) 2.40 (0.095) 2.16 (0.085) SMB (DO-214AA) Land Pattern |
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