Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.

Thermal Resistances

Part #

Symbol

Parameter

Value

Unit

P500-G

Junction to leads (package)

113

°C/W

236

°C/W

P850-G

Junction to leads (package)

119

°C/W

215

°C/W

Reflow Profile

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3 °C/sec. max.

Preheat

- Temperature Min. (Tsmin)

- Temperature Max. (Tsmax)

- Time (tsmin to tsmax)

150 °C

200 °C

60-180 sec.

Time maintained above:

- Temperature (TL)

- Time (tL)

217 °C

60-150 sec.

Peak/Classification Temperature (Tp)

260 °C

Time within 5 °C of Actual Peak Temp. (tp)

20-40 sec.

Ramp-Down Rate

6 °C/sec. max.

Time 25 °C to Peak Temperature

8 min. max.

Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.