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AD9058ATD883B Datasheet(PDF) 9 Page - Analog Devices |
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AD9058ATD883B Datasheet(HTML) 9 Page - Analog Devices |
9 / 11 page REV. AD9058 –9– Die Dimensions . . . . . . . . . 106 mils × 108 mils × 15 (±2) mils Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 4 mils × 4 mils Metallization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –VS Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nitride Die Attach . . . . . . . . . . . . . . . . . . . . Gold Eutectic (Ceramic) Bond Wire . . . . . . . . . 1 mil–1.3 mil, Gold; Gold Ball Bonding GROUND GROUND GROUND GROUND +VS –VS –VS +VS D0 (LSB) D0 (LSB) GROUND GROUND +VREF +VREF +VS AIN AIN +VS MECHANICAL INFORMATION E COMP +VINT |
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