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MPQ8632HGLE-10 Datasheet(PDF) 6 Page - Monolithic Power Systems |
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MPQ8632HGLE-10 Datasheet(HTML) 6 Page - Monolithic Power Systems |
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6 / 46 page  MPQ8632 HIGH EFFICIENCY 18V SYNCHRONOUS STEP-DOWN CONVERTER FAMILY FOR 4A TO 20A MPQ8632 Rev.1.24 www.MonolithicPower.com 6 8/28/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage VIN .......................................21V VSW .......................................-0.3V to VIN + 0.3V VSW (30ns) ..................................-3V to VIN + 3V VBST .....................................................VSW + 6V VBST (30ns)........................................VSW + 6.5V Enable Current IEN (2)................................ 2.5mA All Other Pins................................ –0.3V to +6V Continuous Power Dissipation (TA=+25) (3) QFN3X4 ……………………….…..…………2.7W QFN5X4 ……………………….…..…………3.3W Junction Temperature .............................. 150 C Lead Temperature ................................... 260 C Storage Temperature............... -65 C to +150C Recommended Operating Conditions (4) Supply Voltage VIN .......................... 4.5V to 18V Output Voltage VOUT.................... 0.611V to 13V Enable Current IEN...................................... 1mA Operating Junction Temp. (TJ).-40°C to +125°C Thermal Resistance (5) θJA θJC QFN (3x4mm) ........................ 46 ....... 9.... C/W QFN (5x4mm) ........................ 38 ....... 6.... C/W Notes: 1) Exceeding these ratings may damage the device. 2) Refer to the section “Configuring the EN Control”. 3) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θ JA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 4) The device is not guaranteed to function outside of its operating conditions. 5) Measured on JESD51-7, 4-layer PCB. |
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