Subject to change without notice.

www.cree.com

FEATURES

Small Chip - 200 x 200 x 85 μm

Low Forward Voltage

2.9 V Typical at 5 mA

RT230™ LED Performance

2.0 mW min. Blue (455-475 nm)

1.5 mW min. Green (520-535 nm & 500-

510 nm)

Single Wire Bond Structure

Class 2 ESD Rating

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APPLICATIONS

Mobile Phone Key Pads

White

Blue

Green

Audio Product Display Lighting

Mobile Appliance Keypads

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CxxxRT230-S000

Cree’s RazerThin LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC® substrate to deliver

superior price/performance for blue and green LEDs. These vertically structured LED chips are small in size and

require a low forward voltage. Cree’s RT series chips are tested for conformity to optical and electrical specifications

and the ability to withstand 1000V ESD. Applications include keypad backlighting where sub-miniaturization and

thinner form factors are required.

CxxxRT230-S000 Chip Diagram

Top View

Bottom View

G•SiC LED Chip

200 x 200 μm

SiC Substrate

h = 85 μm

Backside

Metallization

80 x 80 μm

Gold Bond Pad

105 μm Diameter

Side View

Cathode (-)

Anode (+)

Mesa (junction)

176 x 176 μm

InGaN