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MP18024 Datasheet(PDF) 2 Page - Monolithic Power Systems

Part # MP18024
Description  100V, 4A, High Frequency Half-Bridge Gate Driver
Download  12 Pages
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP18024 Datasheet(HTML) 2 Page - Monolithic Power Systems

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MP18024―100V, 4A HIGH FREQUENCY HALF-BRIDGE GATE DRIVER
MP18024 Rev. 1.0
www.MonolithicPower.com
2
6/3/2011
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2011 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number*
Package
Top Marking
MP18024HN
SOIC8E
MP18024HN
* For Tape & Reel, add suffix –Z (e.g. MP18024HN–Z);
For RoHS compliant packaging, add suffix –LF; (e.g. MP18024HN–LF–Z)
PACKAGE REFERENCE
VDD
BST
DRVH
SW
DRVL
VSS
INL
INH
1
2
3
4
8
7
6
5
TOP VIEW
ABSOLUTE MAXIMUM RATINGS (1)
Supply Voltage (VDD).....................-0.3V to +18V
SW Voltage (VSW) .......................-5.0V to +105V
BST Voltage (VBST) .....................-0.3V to +118V
BST to SW ....................................-0.3V to +18V
DRVH to SW............. -0.3V to (BST-SW) + 0.3V
DRVL to VSS ...................-0.3V to (VDD + 0.3V)
All Other Pins.....................-0.3V to (VDD + 0.3V)
Continuous Power Dissipation
(TA = 25°C)
(2)
............................................................. 2.6W
Junction Temperature...............................150
C
Lead Temperature ....................................260
C
Storage Temperature............... -65°C to +150
C
Recommended Operating Conditions
(3)
Supply Voltage VDD .......................9.0V to 16.0V
SW Voltage (VSW) .........................-1.0V to 100V
SW Slew Rate....................................... <50V/ns
Operating Junction Temp. (TJ). -40C to +125C
Thermal Resistance
(4)
θJA
θJC
SOIC8E .................................. 48 ...... 10...
C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-
TA)/ θJA. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.


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