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MP8670DN Datasheet(PDF) 3 Page - Monolithic Power Systems

Part # MP8670DN
Description  6A, 30V, 420KHz Step-Down Converter with Synchronizable Gate Driver
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP8670DN Datasheet(HTML) 3 Page - Monolithic Power Systems

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MP8670 – 6A, 30V, 420KHZ STEP-DOWN WITH SYNCHRONIZABLE GATE DRIVER
MP8670 Rev. 1.3
www.MonolithicPower.com
3
4/4/2011
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2011 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number*
Package
Top Marking
Free Air Temperature
(TA)
MP8670DN
SOIC8E
MP8670DN
–40
°C to +85°C
* For Tape & Reel, add suffix –Z (eg. MP8670DN–Z). For RoHS Compliant Packaging, add suffix –LF (eg.
MP8670DN–LF–Z)
PACKAGE REFERENCE
ABSOLUTE MAXIMUM RATINGS (1)
Supply Voltage VIN ....................................... 32V
VSW...................... –0.3V (–5V for < 10ns) to 33V
VBST – VSW ................................................... 6.5V
All Pins...........................................–0.3V to +6V
Continuous Power Dissipation
(TA = +25°C)
(2)
……………………………………………......2.5W
Junction Temperature...............................150
°C
Lead Temperature ....................................260
°C
Storage Temperature.............. –65
°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage VIN ...........................4.5V to 30V
Operating Junction Temperature–40
°C to +125°C
Thermal Resistance
(4)
θJA
θJC
SOIC8E .................................. 50 ...... 10...
°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a
function of the maximum junction temperature
TJ(MAX), the junction-to-ambient thermal resistance
θJA, and the ambient temperature TA. The maximum
allowable continuous power dissipation at any
ambient
temperature
is
calculated
by
PD(MAX)=(TJ(MAX)-TA)/θJA. Exceeding the maximum
allowable power dissipation will cause excessive die
temperature, and the regulator will go into thermal
shutdown. Internal thermal shutdown circuitry protects
the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
SW
BST
VCC
BG
IN
EN/SYNC
FB
GND
1
2
3
4
8
7
6
5
TOP VIEW
EXPOSED PAD
ON BACKSIDE


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