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MP8125 Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP8125 Datasheet(HTML) 2 Page - Monolithic Power Systems |
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2 / 13 page  MP8125 – LNB POWER SUPPLY AND CONTROL VOLTAGE REGULATOR MP8125 Rev. 1.11 www.MonolithicPower.com 2 5/9/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking Free Air Temperature (TA) MP8125EF* TSSOP-16 MP8125 -20 °C to +85°C MP8125DR QFN24(4x4mm) MP8125 -40 °C to +85°C * For Tape & Reel, add suffix –Z (e.g. MP8125EF–Z). For RoHS compliant packaging, add suffix –LF (e.g. MP8125EF–LF–Z) PACKAGE REFERENCE SGND BYPASS VDD COMP EN LINEDROP POK 13V/18V 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 PGND SW BST VBOOST VOUT ILIMIT TCAP EXTM TOP VIEW TOP VIEW 1 2 3 4 5 6 18 17 16 15 14 13 NC VDD NC COMP EN LINEDROP NC BST VBOOST VBOOST VOUT VOUT 789 10 11 12 24 23 22 21 20 19 EXPOSED PAD CONNECT TO GND TSSOP-16 QFN24 ABSOLUTE MAXIMUM RATINGS (1) VDD ................................................-0.3V to 16V VOUT, SW, VBOOST ....................-0.3V to 25V BST....................................................... VSW +7V All Other Pins................................-0.3V to 6.5 V Continuous Power Dissipation.….(TA=+25°C) (2) TSSOP-16……………………………………2.8W QFN24(4x4mm)………………………………2.9W Junction Temperature...............................150 °C Lead Temperature ....................................260 °C Storage Temperature................. -65°C to 150 °C Recommended Operating Conditions (3) Supply Voltage VIN ..............................8V to 14V Output Voltage VOUT............... 13V/14V/18V/19V Maximum Junction Temp. (TJ) ...............+125°C Thermal Resistance (4) θJA θJC TSSOP-16...............................45 ....... 8 .... °C/W QFN24(4x4mm) ......................42 ....... 9 .... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/ θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7 4-layer PCB |
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