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MP8044DF Datasheet(PDF) 2 Page - Monolithic Power Systems

Part # MP8044DF
Description  22V, 4A Dual Channel Power Half-Bridge
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP8044DF Datasheet(HTML) 2 Page - Monolithic Power Systems

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MP8044 - 22V, 4A DUAL CHANNEL POWER HALF-BRIDGE
M8044 Rev. 1.0
www.MonolithicPower.com
2
5/5/2010
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number*
Package
Top Marking
Free Air Temperature (TA)
MP8044DF
TSSOP20F
MP8044DF
–40
°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP8044DF–Z). For Lead Free, add suffix –LF
(e.g. MP8044DF–LF–Z)
PACKAGE REFERENCE
POR-VFB
AGND1
PWM1
STBYB
PWM2
FAULTB
SHDNB
AGND2
POR-OUT
VDR2
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
VDR1
BST1
PGND1
SW1
VSP
VSP
VSP
SW2
PGND2
BST2
TOP VIEW
EXPOSED PAD
GND
ABSOLUTE MAXIMUM RATINGS (1)
VSP Supply Voltage .................................... 24V
SW1/2 Pin Voltage.............. –0.3V to VSP + 0.3V
SW1/2 to BST1/2 ...........................–0.3V to +6V
Voltage at All Other Pins................–0.3V to +6V
Continuous Power Dissipation (TA = +25°C)
(2)
……………………………………………....3.1W
Storage Temperature.............. –55
°C to +150°C
Junction Temperature.............................150°C
Lead Temperature .................................260°C
Recommended Operating Conditions
(3)
VSP Supply Voltage ........................ 7.5V to 22V
Peak Output Current......................4A Maximum
Operating Junct. Temp (TJ) ......-40°C to +125°C
Thermal Resistance
(4)
θJA
θJC
TSSOP20F ............................. 40 ....... 6....
°C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of
the maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.


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