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Y1624K50000B9R Datasheet(PDF) 2 Page - Vishay Siliconix |
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Y1624K50000B9R Datasheet(HTML) 2 Page - Vishay Siliconix |
2 / 4 page VSMP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil) Vishay Foil Resistors www.vishay.com For any questions, contact: foil@vishay.com Document Number: 63060 2 Revision: 24-Mar-09 Note (1) Land Pattern Dimensions are per IPC-7351A Note (1) As shown + 0.01 Ω to allow for measurement errors at low values. FIGURE 2 - TRIMMING TO VALUES (Conceptual Illustration) Mutual Inductance Reduction due to Change in Current Direction Current Path Before Trimming Note: Foil shown in black, etched spaces in white Interloop Capacitance Reduction in Series Trimming Process Removes this Material from Shorting Strip Area Changing Current Path and Increasing Resistance Current Path After Trimming FIGURE 3 - TYPICAL RESISTANCE/ TEMPERATURE CURVE Note • The TCR values for < 100 Ω are influenced by the termination composition and result in deviation from this curve. + 500 + 200 + 100 0 - 100 - 200 - 300 - 500 - 55 - 25 + 25 + 60 + 75 + 100 + 125 ΔR R (ppm) 0 0.05 ppm/°C - 0.1 ppm/°C 0.1 ppm/°C 0.14 ppm/°C 0.2 ppm/°C - 0.16 ppm/°C - 400 + 300 + 400 Ambient Temperature (°C) and TCR Chord Slopes for Different Temperature Ranges TABLE 2 - DIMENSIONS AND LAND PATTERN in Inches (Millimeters) CHIP SIZE L ± 0.005 (0.13) W ± 0.005 (0.13) THICKNESS MAXIMUM D ± 0.005 (0.13) Z (1) G (1) X (1) 0805 0.080 (2.03) 0.050 (1.27) 0.025 (0.64) 0.015 (0.38) 0.122 (3.10) 0.028 (0.71) 0.050 (1.27) 1206 0.126 (3.20) 0.062 (1.57) 0.025 (0.64) 0.020 (0.51) 0.175 (4.45) 0.059 (1.50) 0.071 (1.80) 1506 0.150 (3.81) 0.062 (1.57) 0.025 (0.64) 0.020 (0.51) 0.199 (5.05) 0.083 (2.11) 0.071 (1.80) 2010 0.198 (5.03) 0.097 (2.46) 0.025 (0.64) 0.025 (0.64) 0.247 (6.27) 0.115 (2.92) 0.103 (2.62) 2512 0.249 (6.32) 0.127 (3.23) 0.025 (0.64) 0.032 (0.81) 0.291 (7.39) 0.150 (3.81) 0.127 (3.23) Top View D T W L Recommended Land Pattern Footprint Z G X TABLE 3 - SPECIFICATIONS CHIP SIZE RATED POWER (mW) at + 70 °C MAX. WORKING VOLTAGE ( ≤ ) RESISTANCE RANGE ( Ω) MAXIMUM WEIGHT (mg) 0805 200 40 V 10 to 8K 6 1206 300 87 V 10 to 25K 11 1506 300 95 V 10 to 30K 12 2010 500 187 V 10 to 70K 27 2512 750 220 V 10 to 125K 40 PR × TABLE 4 - LOAD LIFE STABILITY (+ 70 °C for 2000 h) CHIP SIZE MAXIMUM ΔR LIMITS 0805 ± 0.005 % at 100 mW ± 0.01 % at 200 mW 1206, 1506 ± 0.005 % at 150 mW ± 0.01 % at 300 mW 2010 ± 0.005 % at 200 mW ± 0.01 % at 500 mW 2512 ± 0.005 % at 500 mW ± 0.01 % at 750 mW TABLE 5 - PERFORMANCES TEST OR CONDITIONS MIL-PRF-55342 CHARACTERISTIC E ΔR LIMITS TYPICAL ΔR LIMITS MAXIMUM ΔR LIMITS (1) Thermal Shock, 100 x (- 65 °C to + 150 °C) ± 0.1 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) Low Temperature Operation, - 65 °C, 45 min at Pnom ± 0.1 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) Short Time Overload, 6.25 x Rated Power, 5 s ± 0.1 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) High Temperature Exposure, + 150 °C, 100 h ± 0.1 % ± 0.01 % (100 ppm) ± 0.02 % (200 ppm) Resistance to Soldering Heat ± 0.2 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) Moisture Resistance ± 0.2 % ± 0.005 % (50 ppm) ± 0.02 % (200 ppm) Load Life Stability + 70 °C for 2000 h at Rated Power ± 0.5 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm) |
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