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MPXV7002GC6U Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc

Part # MPXV7002GC6U
Description  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned Temperature Compensated and Calibrated
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPXV7002GC6U Datasheet(HTML) 5 Page - Freescale Semiconductor, Inc

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MPXV7002
Sensors
Freescale Semiconductor
5
Pressure
Figure 4. Output versus Pressure Differential
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
protects the die from harsh media.
The Pressure (P1) side may be identified by using the
following table:
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. Small Outline Package Footprint
Differential Pressure (kPa)
5.0
4.0
3.0
2.0
1.0
0
02
TYPICAL
MIN
-2
-1
1
Transfer Function:
Vout = VS × (0.2 × P(kPa)+0.5) ± 6.25% VFSS
VS = 5.0 Vdc
TA = 10 to 60°C
MAX
Part Number
Case Type
Pressure (P1)
Side Identifier
MPXV7002GC6U/GC6T1
482A-01
Side with Port Attached
MPXV7002GP
1369-01
Side with Port Attached
MPXV7002DP
1351-01
Side with Part Marking
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1


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