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CMZB39 Datasheet(PDF) 4 Page - Toshiba Semiconductor |
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CMZB39 Datasheet(HTML) 4 Page - Toshiba Semiconductor |
4 / 5 page CMZB12~CMZB53 2013-11-01 4 0.001 1000 10 0.1 100 1000 10 0.01 0.1 1 100 1 26 58 42 25 45 50 40 30 34 38 46 30 CMZB30 to CMZB53 35 50 54 15 5 15 25 20 25 30 20 CMZB12 to CMZB27 10 10 10 100 1000 0.1 1 10 0 0.2 0 80 160 0.4 0.6 0.8 1.0 1.2 40 120 Ta max – P Power dissipation P (W) PRSM – tW (reference value) Pulse width tW (ms) αT – VZ (typ.) Zener voltage VZ (V) αT – VZ (typ.) Zener voltage VZ (V) Recommended Ta = 25°C Rectangular pulse PRSM tW Device mounted on a glass-epoxy board: board size: 50 mm × 50 mm Soldering land: 6.0 mm × 6.0 mm board thickness: 1.6 mm rth (j-a) – t Time t (s) Device mounted on a ceramic board: Board size: 50 mm × 50 mm Soldering land: 2.0 mm × 2.0 mm Board thickness: 0.64 mm Device mounted on a glass-epoxy board: Board size: 50 mm × 50 mm Soldering land: 6.0 mm × 6.0 mm Board thickness: 1.6 mm Device mounted on a glass-epoxy board: Board size: 50 mm × 50 mm Soldering land: 2.1 mm × 1.4 mm Board thickness: 1.6 mm |
Similar Part No. - CMZB39 |
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Similar Description - CMZB39 |
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