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MCP1804T-3002IDB Datasheet(PDF) 5 Page - Microchip Technology |
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MCP1804T-3002IDB Datasheet(HTML) 5 Page - Microchip Technology |
5 / 38 page © 2009 Microchip Technology Inc. DS22200B-page 5 MCP1804 TEMPERATURE SPECIFICATIONS Power Supply Ripple Rejection Ratio PSRR — 50 — dB f = 1 kHz, IL = 20 mA, VINAC = 0.5V pk-pk, CIN = 0 µF Thermal Shutdown Protection TSD — 150 — °C TJ Thermal Shutdown Hysteresis ΔTSD — 25 — °C ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VR + 2.0V, Note 1, COUT = 1 µF (X7R), CIN = 1 µF (X7R), VSHDN = VIN, TA = +25°C Parameters Sym Min Typ Max Units Conditions Note 1: The minimum VIN must meet one condition: VIN ≥ (VR + 2.0V). 2: VR is the nominal regulator output voltage with an input voltage of VIN = VR + 2.0V. For example: VR = 1.8V, 2.5V, 3.0V, 3.3V, etc. 3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *10 6 / (V R * ΔTemperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. 4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured value with an applied input voltage of VR + 2.0V. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Operating Temperature Range TA -40 +85 °C Storage Temperature Range Tstg -55 +125 °C Thermal Package Resistance Thermal Resistance, 5LD SOT-23 θ JA θ JC — — 256 81 — — °C/W EIA/JEDEC JESD51-7 FR-4 0.063 4-Layer Board Thermal Resistance, 3LD SOT-89 Thermal Resistance, 5LD SOT-89 θ JA θ JC — — 180 100 — — °C/W EIA/JEDEC JESD51-7 FR-4 0.063 4-Layer Board Thermal Resistance, 3LD SOT-223 θ JA θ JC — — 62 15 — — °C/W EIA/JEDEC JESD51-7 FR-4 0.063 4-Layer Board |
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