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AOWF11C60 Datasheet(PDF) 3 Page - Alpha & Omega Semiconductors |
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AOWF11C60 Datasheet(HTML) 3 Page - Alpha & Omega Semiconductors |
3 / 3 page 3 III. Reliability Stress Test Summary and Results *Note: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 3.05 MTTF = 37419 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. Failure Rate = Chi 2 x 109 / [2 (N) (H) (Af)] = 3.05 MTTF = 10 9 / FIT = 37419 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from burn-in tests H = Duration of burn-in testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C Af 259 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10 -5eV / K Test Item Test Condition Time Point Total Sample Size* Number of Failures Reference Standard MSL Precondition 168hr 85°C / 85%RH + 3 cycle reflow@260°C (MSL 1) - 4389 pcs 0 JESD22-A113 HTGB Temp = 150°C , Vgs=100% of Vgsmax 168 / 500 / 1000 hours 924 pcs 0 JESD22-A108 HTRB Temp = 150°C , Vds=80% of Vdsmax 168 / 500 / 1000 hours 924 pcs 0 JESD22-A108 HAST 130°C , 85%RH, 33.3 psi, Vds = 80% of Vdsmax up to 42V 96 hours 924 pcs 0 JESD22-A110 H3TRB 85°C , 85%RH, Vds = 80% of Vdsmax up to 100V 1000 hours 693 pcs 0 JESD22-A101 Autoclave 121°C , 29.7psi, RH=100% 96 hours 924 pcs 0 JESD22-A102 Temperature Cycle -65°C to 150°C , air to air, 250 / 500 cycles 924 pcs 0 JESD22-A104 Power Cycling Tj = 100°C 8572 cycles 924 pcs 0 AEC Q101 |
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