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MP3425DL Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP3425DL Datasheet(HTML) 2 Page - Monolithic Power Systems |
2 / 13 page MP3425- 3A, 55V BOOST CONVERTER WITH PROGRAMMABLE SWITCHING FREQUENCY AND UVLO MP3425 Rev.1.02 www.MonolithicPower.com 2 6/28/2013 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2013 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking Free Air Temperature (TA) MP3425DL 3x4mm QFN 14 3425 -40 °C to +85°C * For Tape & Reel, add suffix –Z (e.g. MP3425DL–Z); For RoHS compliant packaging, add suffix –LF (e.g. MP3425DL–LF–Z) PACKAGE REFERENCE 14 13 12 11 10 9 8 1 2 3 4 5 6 7 TOP VIEW EXPOSED PAD COMP EN VIN SW SW SW VDD FSET FB SS AGND PGND PGND PGND 3x4mm QFN 14 ABSOLUTE MAXIMUM RATINGS (1) SW ................................................-0.5V to +55V IN ................................................-0.5V to +22V All Other Pins...............................-0.3V to +6.5V Continuous Power Dissipation (TA = +25°C) (2) QFN14 ....................................................... 2.5W Junction Temperature...............................150 °C Lead Temperature ....................................260 °C Storage Temperature............... -65 °C to +150°C Recommended Operating Conditions (3) Supply Voltage VIN ...........................3.1V to 22V Output Voltage VOUT.........................3.1V to 55V Operating Junct. Temp (TJ)..... - 40°C to +125°C Thermal Resistance θJA θJC QFN14 ....................................50 ...... 12 ... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. |
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