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BH31MA3WHFV-TR Datasheet(PDF) 7 Page - Rohm |
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BH31MA3WHFV-TR Datasheet(HTML) 7 Page - Rohm |
7 / 13 page Datasheet Datasheet 7/10 TSZ02201-0RBR0A300170-1-2 © 2012 ROHM Co., Ltd. All rights reserved. 25.Sep.2013 Rev.001 www.rohm.com TSZ22111・15・001 BHxxMA3 series ●About input/output capacitor It is recommended that an input capacitor is placed near pins between the VCC pin and GND as well as an output capacitor between the output pin and GND. The input is valid when the power supply impedance is high or when the PCB trace has significant length. For the output capacitor, the greater the capacitance, the more stable the output will be depending on the load and line voltage variations. However, please check the actual functionality of this capacitor by mounting it on a board for the actual application. Ceramic capacitors usually have different, thermal and equivalent series resistance characteristics, and may degrade gradually over continued use. For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application ●Equivalent Series Resistance (ESR) of a Ceramic Capacitor Capacitors generally have ESR (equivalent series resistance) and it operates stably in the ESR-IOUT area shown on the right. Since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different ESR, please check the ESR of the capacitor to be used and use it within the stability area range shown in the right graph for evaluation of the actual application. ●Power Dissipation (Pd) As for power dissipation, an estimate of heat reduction characteristics and internal power consumption of IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as causing the operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage. Calculation of the maximum internal power consumption of IC (PMAX) PMAX=(VIN-VOUT)×IOMAX Where : VIN=Input voltage VOUT= Output voltage IOMAX: Maximum output current 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 25 50 75 100 125 Ta (℃) 0.68W 85 Standard ROHM board Capacity value of ceramic capacitor - DC bias characteristics (Example) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 00.5 1 1.5 22.53 3.54 DC Bias Voltage [V] 10-V withstand voltage B1characteristics GRM188B11A105KA61D 10-V withstand voltag e B characteristics 6.3-V withstand voltage B characteristics 4-V withstand voltag e X6S characteristics 10-V withstand voltag e F characteristics 10-V withstand voltage F characteristics * Please design the margin so that PMAX becomes is than Pd (PMAX <Pd) within the usage temperature range Figure 13.HVSOF6 Power dissipation heat reduction characteristics (Reference) 0.01 0.1 1 10 100 0 50 100 150 200 250 300 Output Current IOUT [mA] Stable region Cout=1.0 μF,Cin=1.0μF,Temp=+25℃ Figure 12. Stable region (example) Figure 11. Capacity-bias characteristics |
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