20–24 GHz Low Noise Amplifier

AA022N1-65

4

Alpha Industries, Inc. [781] 935-5150

• Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com

Specifications subject to change without notice. 2/00A

Leaded Millimeterwave Package

Handling and Mounting

The leaded millimeterwave package requires careful

mounting design to maintain optimal performance.

Handling

The leaded millimeterwave package is extremely rugged.

Care should be exercised when handling with metal tools.

Only personnel trained in both ESD precautions and

handling precautions should be allowed to handle these

packages.

Package Construction

The construction of the leaded millimeterwave package

consists of a metal base and ceramic walls. The

package is topped by a solder-sealed metal lid. All metal

parts are gold-plated.

Mounting Design

The leaded millimeterwave package is mounted by placing

it in a hole cut in a printed circuit board. The bottom of the

package leads should be in the same plane as the top

surface of the printed circuit board traces. The hole should

be cut as close as possible to the outer dimensions of the

package to minimize the gap between package and

printed circuit board. The gap should be no more than

0.005" (0.127 mm). The base of the package should be

mounted directly to a surface that provides a good ground

plane for the printed circuit board and provides a good

thermal ground.

Mounting the Package

The leaded millimeterwave package should be attached

to its mounting surface using a silver-filled conductive

paste epoxy or solder. Care should be taken to ensure that

there are no voids or gaps in the epoxy or solder underfill

so that a good ground contact is maintained.

Screw hardware attachment should be used in addition

to epoxy or solder in situations where additional

mechanical integrity is desired. Care should be exercised

when tightening screws because over-tightening could

deform the package base.

Connecting the Package

Connection of the package leads to the printed circuit

board traces is accomplished with solder. Attached leads

should lie flat upon the printed circuits board traces.

Package leads can be trimmed if desired.

Leaded Millimeterwave Package Mounting

Printed Circuit Board

Rogers 4003

0.008" (0.20 mm) Thick

Electrically & Thermally

Conductive Ground Plane

Minimize RF

Gap Widths

Soldered Leads

RF In

RF Out

DC Connection

0–80 Screw