Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications

Product Dimensions

CG0805

Dimension

Series

L

1.25 ± 0.20

(0.049 ± 0.008)

W

2.00 ± 0.20

(0.080 ± 0.008)

T

0.90

(0.035) MAX.

BW

0.20 ± 0.10

(0.008 ± 0.004)

BL

0.20 ± 0.10

(0.008 ± 0.004)

P

0.50

(0.020)

X

0.75 ± 0.10

(0.029 ± 0.004)

S

0.25 ± 0.10

(0.009 ± 0.004)

DIMENSIONS:

MM

(INCHES)

Recommended Pad Layout

Solder Reflow Recommendations

110 sec. (min.)

300

250

200

150

100

50

0

30-70

sec.

120 sec. (min.)

Preheat Stages 1-3

Soldering

Cooling

Time (seconds)

•

This product can be damaged by rapid heating, cooling or localized heating.

•

Heat shocks should be avoided. Preheating and gradual cooling recommended.

•

Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.

•

Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.

A solder gun under 30 watts is recommended.

A

Stage 1 Preheat

Ambient to Preheating

30 s to 60 s

Temperature

B

Stage 2 Preheat

140 °C to 160 °C

60 s to 120 s

C

Stage 3 Preheat

Preheat to 200 °C

20 s to 40 s

D

Main Heating

200 °C

60 s to 70 s

210 °C

55 s to 65 s

220 °C

50 s to 60 s

230 °C

40 s to 50 s

240 °C

30 s to 40 s

E

Cooling

200 °C to 100 °C

1 °C/s to 4 °C/s

BL

L

T

P

X

BW

S

X

W

A

D

E

B

C

CG0805

Dimension

Series

A

0.64

(0.025)

B

1.27

(0.050)

C

1.91

(0.075)

D

0.28

(0.011)

E

0.51

(0.020)