Metal Package Full Size DIP and Half DIP, TTL / HC-MOS

HCOF/HCOH Series

12/10_A

Specifications subject to change without notice

Page 2

Pb Free Solder Reflow Profile:

Typical Application:

*Units are backward compatible with 240C reflow processes

Package Information:

MSL = N.A. (package does not contain plastic, storage life is

unlimited under normal room conditions).

Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).

Environmental Specifications

Thermal Shock

MIL-STD-883, Method 1011, Condition A

Moisture Resistance

MIL-STD-883, Method 1004

Mechanical Shock

MIL-STD-883, Method 2002, Condition B

Mechanical Vibration

MIL-STD-883, Method 2007, Condition A

Resistance to Soldering Heat

J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)

Hazardous Substance

Pb-Free / RoHS / Green Compliant

Solderability

JESD22-B102-D Method 2 (Preconditioning E)

Terminal Strength

MIL-STD-883, Method 2004, Test Condition D

Gross Leak

MIL-STD-883, Method 1014, Condition C

Fine Leak

MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s

Solvent Resistance

MIL-STD-202, Method 215

Marking

Line 1: ILSI and Date Code

Line 2: XXXXXX (Part Number detail = HCOH-XXXXXX-Freq.)

Line 3: Frequency