HR1000A datasheet(3/23 Pages) MPS

Part #	HR1000A

Description	Resonant Half-Bridge Controller

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Manufacturer	MPS [Monolithic Power Systems]

Direct Link	http://www.monolithicpower.com

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HR1000A – RESONANT HALF-BRIDGE CONTROLLER

HR1000A Rev. 1.01

www.MonolithicPower.com

3

8/30/2012

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

HR1000AGS

SOIC16

HR1000A

* For Tape & Reel, add suffix –Z (e.g. HR1000AGS–Z).

PACKAGE REFERENCE

SS

TIMER

CT

Fset

BST

HG

SW

N.C.

1

2

3

4

16

15

14

13

VCC

LG

GND

PFC

12

11

10

9

Burst

CS

BO

LATCH

5

6

7

8

TOP VIEW

ABSOLUTE MAXIMUM RATINGS (1)

Symbol

Parameter

Value

Unit

VBST

16

Floating supply voltage

-1 to 618

V

VSW

14

Floating ground voltage

-3 to VBST-18

V

dVSW/dt

14

Floating ground max. slew rate

50

V/ns

VCC

12

IC supply voltage (ICC<25mA)

Self-limited

V

VPFC

9

Maximum voltage (pin open)

-0.3 to VCC

V

IPFC

9

Maximum sink current (pin low)

Self-limited

A

IFset

4

Maximum source current

2

mA

LG

11

Maximum voltage

-0.3 to 16

V

1 to 8

Analog inputs and outputs

-0.3 to 6

V

PIC

Continuous power dissipation (TA = +25°C)

(2)

1.56

W

TJ

Junction Temperature

150

°C

TLead

Lead Temperature (Solder)

260

°C

TStorage

Storage Temperature

-55 to +150

°C

Recommended Operating Conditions

(3)

Supply Voltage VCC ......................13V to 15.5V

Analog inputs and outputs .............-0.3V to 6.5V

Operating Junction Temp (TJ). -40°C to + 125°C

Thermal Resistance

(4)

θJA

θJC

SOIC16 ...................................80 ...... 35... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any

ambient

temperature

is

calculated

by

D(MAX)=(TJ(MAX)- TA)/ θJA. Exceeding the maximum

allowable power dissipation will cause excessive die

temperature, and the regulator will go into thermal shutdown.

Internal thermal shutdown circuitry protects the device from

permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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