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HR1000A Datasheet(PDF) 3 Page - Monolithic Power Systems |
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HR1000A Datasheet(HTML) 3 Page - Monolithic Power Systems |
3 / 23 page HR1000A – RESONANT HALF-BRIDGE CONTROLLER HR1000A Rev. 1.01 www.MonolithicPower.com 3 8/30/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2012 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking HR1000AGS SOIC16 HR1000A * For Tape & Reel, add suffix –Z (e.g. HR1000AGS–Z). PACKAGE REFERENCE SS TIMER CT Fset BST HG SW N.C. 1 2 3 4 16 15 14 13 VCC LG GND PFC 12 11 10 9 Burst CS BO LATCH 5 6 7 8 TOP VIEW ABSOLUTE MAXIMUM RATINGS (1) Symbol Pin Parameter Value Unit VBST 16 Floating supply voltage -1 to 618 V VSW 14 Floating ground voltage -3 to VBST-18 V dVSW/dt 14 Floating ground max. slew rate 50 V/ns VCC 12 IC supply voltage (ICC<25mA) Self-limited V VPFC 9 Maximum voltage (pin open) -0.3 to VCC V IPFC 9 Maximum sink current (pin low) Self-limited A IFset 4 Maximum source current 2 mA LG 11 Maximum voltage -0.3 to 16 V 1 to 8 Analog inputs and outputs -0.3 to 6 V PIC Continuous power dissipation (TA = +25°C) (2) 1.56 W TJ Junction Temperature 150 °C TLead Lead Temperature (Solder) 260 °C TStorage Storage Temperature -55 to +150 °C Recommended Operating Conditions (3) Supply Voltage VCC ......................13V to 15.5V Analog inputs and outputs .............-0.3V to 6.5V Operating Junction Temp (TJ). -40°C to + 125°C Thermal Resistance (4) θJA θJC SOIC16 ...................................80 ...... 35... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by D(MAX)=(TJ(MAX)- TA)/ θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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