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HFC0310 Datasheet(PDF) 3 Page - Monolithic Power Systems

Part # HFC0310
Description  Fixed-Frequency Flyback Controller
Download  17 Pages
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Manufacturer  MPS [Monolithic Power Systems]
Direct Link  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

HFC0310 Datasheet(HTML) 3 Page - Monolithic Power Systems

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HFC0310 –FIXED-FREQUENCY FLYBACK CONTROLLER
HFC0310 Rev. 1.01
www.MonolithicPower.com
3
6/19/2012
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2012 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number*
Package
Top Marking
Free Air Temperature (TA)
HFC0310GS
SOIC8
HFC0310
–40°C to +105°C
* For Tape & Reel, add suffix –Z (e.g. HFC0310GS–Z);
PACKAGE REFERENCE
ABSOLUTE MAXIMUM RATINGS
(1)
Vcc................................................–0.3V to 30 V
All Other Pins..................................–0.3V to 7 V
Continuous Power Dissipation (TA = +25°C)
(2)
SOIC8 ...................................................... 1.04W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -60°C to +150°C
Thermal Shut Down ..................................150°C
Thermal Shut Down Hysteresis ..................40°C
ESD Capability Human Body Model (All Pins
except Drain) ........................................... 2.0kV
ESD Capability Machine Model ................. 200V
Operating Temperature........... –40°C to +105°C
Recommended Operation Conditions
(3)
VCC to GND ......................................... 8V to 20V
Maximum Junction Temp. (TJ) .............. +125°C
Thermal Resistance
(4)
θJA
θJC
SOIC8..................................... 96 ...... 45... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.


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