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HFC0310 Datasheet(PDF) 3 Page - Monolithic Power Systems |
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HFC0310 Datasheet(HTML) 3 Page - Monolithic Power Systems |
3 / 17 page HFC0310 –FIXED-FREQUENCY FLYBACK CONTROLLER HFC0310 Rev. 1.01 www.MonolithicPower.com 3 6/19/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2012 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking Free Air Temperature (TA) HFC0310GS SOIC8 HFC0310 –40°C to +105°C * For Tape & Reel, add suffix –Z (e.g. HFC0310GS–Z); PACKAGE REFERENCE ABSOLUTE MAXIMUM RATINGS (1) Vcc................................................–0.3V to 30 V All Other Pins..................................–0.3V to 7 V Continuous Power Dissipation (TA = +25°C) (2) SOIC8 ...................................................... 1.04W Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature............... -60°C to +150°C Thermal Shut Down ..................................150°C Thermal Shut Down Hysteresis ..................40°C ESD Capability Human Body Model (All Pins except Drain) ........................................... 2.0kV ESD Capability Machine Model ................. 200V Operating Temperature........... –40°C to +105°C Recommended Operation Conditions (3) VCC to GND ......................................... 8V to 20V Maximum Junction Temp. (TJ) .............. +125°C Thermal Resistance (4) θJA θJC SOIC8..................................... 96 ...... 45... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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