EXPOSED

THERMAL PAD

TPS56628

DDA

HSOP8

VFB

2

1

EN

3

VREG5

VBST

7

SW

6

GND

5

8

VIN

4

PG

TPS56628

www.ti.com

SLVSC94 – OCTOBER 2013

DEVICE INFORMATION

DDA PACKAGE

(TOP VIEW)

PIN FUNCTIONS

PIN

DESCRIPTION

NAME

NO.

EN

1

Enable input control. EN is active high and must be pulled up to enable the device.

VFB

2

Converter feedback input. Connect to output voltage with feedback resistor divider.

5.5 V power supply output. A capacitor (typical 1 µF) should be connected to GND. VREG5 is not active

VREG5

3

when EN is low.

PG

4

Open drain power good output

Ground pin. Power ground return for switching circuit. Connect sensitive SS and VFB returns to GND at

GND

5

a single point.

SW

6

Switch node connection between high-side NFET and low-side NFET.

Supply input for the high-side FET gate drive circuit. Connect 0.1 µF capacitor between VBST and SW

VBST

7

pins. An internal diode is connected between VREG5 and VBST.

VIN

8

Input voltage supply pin.

Exposed Thermal

Thermal pad of the package. Must be soldered to achieve appropriate dissipation. Must be connected to

Back side

Pad

GND.

Copyright © 2013, Texas Instruments Incorporated

5

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