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LM337BD2TR4G Datasheet(PDF) 2 Page - ON Semiconductor |
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LM337BD2TR4G Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 10 page LM337 http://onsemi.com 2 MAXIMUM RATINGS (TA = +25°C, unless otherwise noted) Rating Symbol Value Unit Input−Output Voltage Differential VI−VO 40 Vdc Power Dissipation Case 221A TA = +25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case Case 936 (D2PAK) TA = +25°C Thermal Resistance, Junction−to−Ambient Thermal Resistance, Junction−to−Case PD qJA qJC PD qJA qJC Internally Limited 65 5.0 Internally Limited 70 5.0 W °C/W °C/W W °C/W °C/W Operating Junction Temperature Range TJ −40 to +125 °C Storage Temperature Range Tstg −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (|VI−VO| = 5.0 V; IO = 0.5 A for T package; TJ = Tlow to Thigh [Note 1]; Imax and Pmax [Note 2].) Characteristics Figure Symbol Min Typ Max Unit Line Regulation (Note 3), TA = +25°C, 3.0 V ≤ |VI−VO| ≤ 40 V 1 Regline − 0.01 0.04 %/V Load Regulation (Note 3), TA = +25°C, 10 mA ≤ IO ≤ Imax |VO| ≤ 5.0 V |VO| ≥ 5.0 V 2 Regload − − 15 0.3 50 1.0 mV % VO Thermal Regulation, TA = +25°C (Note 5), 10 ms Pulse Regtherm − 0.003 0.04 % VO/W Adjustment Pin Current 3 IAdj − 65 100 mA Adjustment Pin Current Change, 2.5 V ≤ |VI−VO| ≤ 40 V, 10 mA ≤ IL ≤ Imax, PD ≤ Pmax, TA = +25°C 1, 2 DIAdj − 2.0 5.0 mA Reference Voltage, TA = +25°C, 3.0 V ≤ |VI−VO| ≤ 40 V, 10 mA ≤ IO ≤ Imax, PD ≤ Pmax, TJ = Tlow to Thigh 3 Vref −1.213 −1.20 −1.250 −1.25 −1.287 −1.30 V Line Regulation (Note 3), 3.0 V ≤ |VI−VO| ≤ 40 V 1 Regline − 0.02 0.07 %/V Load Regulation (Note 3), 10 mA ≤ IO ≤ Imax |VO| ≤ 5.0 V |VO| ≥ 5.0 V 2 Regload − − 20 0.3 70 1.5 mV % VO Temperature Stability (Tlow ≤ TJ ≤ Thigh) 3 TS − 0.6 − % VO Minimum Load Current to Maintain Regulation (|VI−VO| ≤ 10 V) (|VI−VO| ≤ 40 V) 3 ILmin − − 1.5 2.5 6.0 10 mA Maximum Output Current |VI−VO| ≤ 15 V, PD ≤ Pmax, T Package |VI−VO| ≤ 40 V, PD ≤ Pmax, TJ = +25°C, T Package 3 Imax − − 1.5 0.15 2.2 0.4 A RMS Noise, % of VO, TA = +25°C, 10 Hz ≤ f ≤ 10 kHz N − 0.003 − % VO Ripple Rejection, VO = −10 V, f = 120 Hz (Note 4) Without CAdj CAdj = 10 mF 4 RR − 66 60 77 − − dB Long−Term Stability, TJ = Thigh (Note 6), TA = +25°C for Endpoint Measurements 3 S − 0.3 1.0 %/1.0 k Hrs. Thermal Resistance, Junction−to−Case, T Package RqJC − 4.0 − °C/W 1. Tlow to Thigh = 0° to +125°C, for LM337T, D2T. Tlow to Thigh = −40° to +125°C, for LM337BT, BD2T. 2. Imax = 1.5 A, Pmax = 20 W 3. Load and line regulation are specified at constant junction temperature. Change in VO because of heating effects is covered under the Thermal Regulation specification. Pulse testing with a low duty cycle is used. 4. CAdj, when used, is connected between the adjustment pin and ground. 5. Power dissipation within an IC voltage regulator produces a temperature gradient on the die, affecting individual IC components on the die. These effects can be minimized by proper integrated circuit design and layout techniques. Thermal Regulation is the effect of these temperature gradients on the output voltage and is expressed in percentage of output change per watt of power change in a specified time. 6. Since Long Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average stability from lot to lot. |
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