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LM337BD2T Datasheet(PDF) 2 Page - ON Semiconductor

Part # LM337BD2T
Description  1.5 A, Adjustable Output, Negative Voltage Regulator
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

LM337BD2T Datasheet(HTML) 2 Page - ON Semiconductor

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LM337
http://onsemi.com
2
MAXIMUM RATINGS (TA = +25°C, unless otherwise noted)
Rating
Symbol
Value
Unit
Input−Output Voltage Differential
VI−VO
40
Vdc
Power Dissipation
Case 221A
TA = +25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Case 936 (D2PAK)
TA = +25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
PD
qJA
qJC
PD
qJA
qJC
Internally Limited
65
5.0
Internally Limited
70
5.0
W
°C/W
°C/W
W
°C/W
°C/W
Operating Junction Temperature Range
TJ
−40 to +125
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (|VI−VO| = 5.0 V; IO = 0.5 A for T package; TJ = Tlow to Thigh [Note 1]; Imax and Pmax [Note 2].)
Characteristics
Figure
Symbol
Min
Typ
Max
Unit
Line Regulation (Note 3), TA = +25°C, 3.0 V ≤ |VI−VO| ≤ 40 V
1
Regline
0.01
0.04
%/V
Load Regulation (Note 3), TA = +25°C, 10 mA ≤ IO ≤ Imax
|VO| ≤ 5.0 V
|VO| ≥ 5.0 V
2
Regload
15
0.3
50
1.0
mV
% VO
Thermal Regulation, TA = +25°C (Note 5), 10 ms Pulse
Regtherm
0.003
0.04
% VO/W
Adjustment Pin Current
3
IAdj
65
100
mA
Adjustment Pin Current Change, 2.5 V ≤ |VI−VO| ≤ 40 V,
10 mA ≤ IL ≤ Imax, PD ≤ Pmax, TA = +25°C
1, 2
DIAdj
2.0
5.0
mA
Reference Voltage, TA = +25°C, 3.0 V ≤ |VI−VO| ≤ 40 V,
10 mA ≤ IO ≤ Imax, PD ≤ Pmax, TJ = Tlow to Thigh
3
Vref
−1.213
−1.20
−1.250
−1.25
−1.287
−1.30
V
Line Regulation (Note 3), 3.0 V ≤ |VI−VO| ≤ 40 V
1
Regline
0.02
0.07
%/V
Load Regulation (Note 3), 10 mA ≤ IO ≤ Imax
|VO| ≤ 5.0 V
|VO| ≥ 5.0 V
2
Regload
20
0.3
70
1.5
mV
% VO
Temperature Stability (Tlow ≤ TJ ≤ Thigh)
3
TS
0.6
% VO
Minimum Load Current to Maintain Regulation
(|VI−VO| ≤ 10 V)
(|VI−VO| ≤ 40 V)
3
ILmin
1.5
2.5
6.0
10
mA
Maximum Output Current
|VI−VO| ≤ 15 V, PD ≤ Pmax, T Package
|VI−VO| ≤ 40 V, PD ≤ Pmax, TJ = +25°C, T Package
3
Imax
1.5
0.15
2.2
0.4
A
RMS Noise, % of VO, TA = +25°C, 10 Hz ≤ f ≤ 10 kHz
N
0.003
% VO
Ripple Rejection, VO = −10 V, f = 120 Hz (Note 4)
Without CAdj
CAdj = 10 mF
4
RR
66
60
77
dB
Long−Term Stability, TJ = Thigh (Note 6), TA = +25°C for
Endpoint Measurements
3
S
0.3
1.0
%/1.0 k
Hrs.
Thermal Resistance, Junction−to−Case, T Package
RqJC
4.0
°C/W
1. Tlow to Thigh = 0° to +125°C, for LM337T, D2T.
Tlow to Thigh = −40° to +125°C, for LM337BT, BD2T.
2. Imax = 1.5 A, Pmax = 20 W
3. Load and line regulation are specified at constant junction temperature. Change in VO because of heating effects is covered under the
Thermal Regulation specification. Pulse testing with a low duty cycle is used.
4. CAdj, when used, is connected between the adjustment pin and ground.
5. Power dissipation within an IC voltage regulator produces a temperature gradient on the die, affecting individual IC components on the die.
These effects can be minimized by proper integrated circuit design and layout techniques. Thermal Regulation is the effect of these
temperature gradients on the output voltage and is expressed in percentage of output change per watt of power change in a specified time.
6. Since Long Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average
stability from lot to lot.


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