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TLE2426CP Datasheet(PDF) 3 Page - Texas Instruments |
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TLE2426CP Datasheet(HTML) 3 Page - Texas Instruments |
3 / 30 page TLE2426, TLE2426Y THE RAIL SPLITTER" PRECISION VIRTUAL GROUND SLOS098D − AUGUST 1991 − REVISED MAY 1998 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 description (continued) The C-suffix devices are characterized for operation from 0 °C to 70°C. The I suffix devices are characterized for operation from −40 °C to 85°C. The M suffix devices are characterized over the full military temperature range of −55 °C to 125°C. OUT IN COMMON 1 2 3 4 8 7 6 5 OUT COMMON IN NC NOISE REDUCTION NC NC NC D, JG, OR P PACKAGE (TOP VIEW) NC − No internal connection LP PACKAGE (TOP VIEW) TLE2426Y chip information This chip, properly assembled, displays characteristics similar to the TLE2426C. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. 60 88 OUT (1) (2) (8) (3) NOISE REDUCTION IN COMMON +1 NOTE A: Both bonding pads numbered 1, both numbered 2, and both numbered 3, must be bonded out to the corresponding functions pin. (3) (3) (2) (2) (1) (1) (8) |
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