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ISO7141FCCDBQ Datasheet(PDF) 3 Page - Texas Instruments |
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ISO7141FCCDBQ Datasheet(HTML) 3 Page - Texas Instruments |
3 / 22 page ISO7131CC, ISO7140CC, ISO7140FCC ISO7141CC, ISO7141FCC www.ti.com SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013 ABSOLUTE MAXIMUM RATINGS (1) PARAMETER VALUE Supply voltage(2) VCC1, VCC2 –0.5 V to 6 V Input voltage INx, ENx –0.5 V to 6 V Output voltage OUTx –0.5 V to VCC+ 0.5 V Output current IO ±15 mA Human-body model ESDA / JEDEC JS-001-2012 ±4 kV Electrostatic discharge All pins Field-induced charged device JEDEC JESD22-C101E ±1.5 kV model Maximum junction TJ 150°C temperature Storage temperature TSTG –65°C to 150°C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak voltage values. RECOMMENDED OPERATING CONDITIONS PARAMETER MIN TYP MAX UNIT VCC1, VCC2 Supply voltage 2.7 5.5 V High-level output current (VCC ≥ 3.0 V) –4 mA IOH High-level output current (VCC < 3.0 V) –2 mA IOL Low-level output current 4 mA VIH High-level input voltage 2 VCC V VIL Low-level input voltage 0 0.8 V tui Input pulse duration (VCC ≥ 4.5V) 20 ns tui Input pulse duration (VCC < 4.5V) 25 ns 1 / tui Signaling rate (VCC ≥ 4.5V) 0 50 Mbps 1 / tui Signaling rate (VCC < 4.5V) 0 40 Mbps TJ Junction temperature –40 136 °C TA Ambient temperature –40 25 125 °C THERMAL INFORMATION ISO7131, ISO714x THERMAL METRIC(1) UNIT DBQ (16 Pins) θJA Junction-to-ambient thermal resistance 104.5 °C/W θJC(top) Junction-to-case(top) thermal resistance 57.8 °C/W θJB Junction-to-board thermal resistance 46.8 °C/W ψJT Junction-to-top characterization parameter 18.3 °C/W ψJB Junction-to-board characterization parameter 46.4 °C/W θJC(bottom) Junction-to-case(bottom) thermal resistance n/a °C/W VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF PD Device power dissipation 150 mW Input a 25-MHz, 50% duty cycle square wave (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC |
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