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APL3225 Datasheet(PDF) 8 Page - Anpec Electronics Coropration |
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APL3225 Datasheet(HTML) 8 Page - Anpec Electronics Coropration |
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8 / 15 page  Copyright © ANPEC Electronics Corp. Rev. A.1 - Nov., 2012 APL3225 www.anpec.com.tw 8 Application Information Capacitor Selection The input capacitor is for decoupling and prevents the input voltage from overshooting to dangerous levels. In the AC adapter hot plug-in applications or load current step-down transient, the input voltage has a transient spike due to the parasitic inductance of the input cable. A 25V, X5R, dielectric ceramic capacitor with a value be- tween 1 µF and 4.7µF placed close to the ACIN pin is recommended. The output capacitor of CHR_LDO is for CHR_LDO volt- age decoupling. And also can be as the input capacitor of the charging circuit. At least, a 1 µF, 10V, X5R capacitor is recommended. Layout Consideration In some failure modes, a high voltage may be applied to the device. Make sure the clearance constraint of the PCB layout must satisfy the design rule for high voltage. The exposed pad of the TDFN2x2-8 and DFN3x3-8 performs the function of channeling heat away. It is recommended that connect the exposed pad to a large copper ground plane on the backside of the circuit board through sev- eral thermal vias to improve heat dissipation. The input and output capacitors should be placed close to the IC. The high current traces like input trace and output trace must be wide and short. Recommended Minimum Footprint TDFN2x2-8 Thermal Via diameter 12mil X 5 Ground plane for Thermal PAD 0.241mm 0.508mm 0.222mm 0.8mm 0.572mm Thermal Via diameter 12mil X 5 Ground plane for Thermal PAD 0.305mm 0.66mm 0.305mm 0.61mm DFN3X3-8 1.575mm |
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