Copyright

© ANPEC Electronics Corp.

Rev. A.1 - Sep., 2011

APL3215/A

www.anpec.com.tw

2

Ordering and Marking Information

Symbol

Parameter

Rating

Unit

ACIN Input Voltage (ACIN to GND)

-0.3 ~ 20

V

CHRIN to GND Voltage

-0.3 ~ 7

V

GATDRV to GND Voltage

V

VBAT to GND Voltage

-0.3 ~ 7

V

OUT to GND Voltage

-0.3 ~ 7

V

OUT Output Current

1.5

A

Maximum Junction Temperature

150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature, 10 Seconds

260

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance in Free Air

(Note 2)

TDFN2x2-8

75

Thermal Characteristic

Note 2:

θ

of TDFN2x2-8 is soldered directly on the PCB.

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

APL3215

APL3215A

Package Code

Operating Ambient Temperature Range

Handling Code

TR : Tape & Reel

Assembly Material

Handling Code

Temperature Range

Package Code

X - Date Code

G : Halogen and Lead Free Device

Assembly Material

QB : TDFN2x2-8

APL3215 QB:

L15

X

X - Date Code

APL3215A QB:

L15A

X