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www.johansontechnology.com

SPECIFICATION

TEST PARAMETERS

SOLDERABILITY:

Solder coverage

≥ 90% of metalized areas

Preheat chip to 120°-150°C for 60 sec., dip terminals in rosin flux

No termination degradation

then dip in Sn62 solder @ 240°±5°C for 5±1 sec

RESISTANCE TO

No mechanical damage

Preheat device to 80°-100°C for 60 sec.

SOLDERING HEAT:

Capacitance change: ±2.5% or 0.25pF

followed by 150°-180°C for 60 sec.

Q>500 I.R. >10 G Ohms

Dip in 260°±5°C solder for 10±1 sec.

Breakdown voltage: 2.5 x WVDC

Measure after 24±2 hour cooling period

TERMINAL

Termination should not pull off.

Linear pull force* exerted on axial leads soldered to each terminal.

ADHESION:

Ceramic should remain undamaged.

*0402

≥ 2.0lbs, 0603 ≥ 2.0lbs (min.)

PCB DEFLECTION:

No mechanical damage.

Glass epoxy PCB: 0.5 mm deflection

Capacitance change: 2% or 0.5pF Max

LIFE TEST:

No mechanical damage

Applied voltage: 200% rated voltage, 50 mA max.

Capacitance change: ±3.0% or 0.3 pF

Temperature: 125°±3°C

Q>500 I.R. >1 G Ohms

Test time: 1000+48-0 hours

Breakdown voltage: 2.5 x WVDC

THERMAL CYCLE:

No mechanical damage.

5 cycles of: 30±3 minutes @ -55°+0/-3°C,

Capacitance change: ±2.5% or 0.25pF

2-3 min. @ 25°C, 30±3 min. @ +125°+3/-0°C,

Q>2000 I.R. >10 G Ohms

2-3 min. @ 25°C

Breakdown voltage: 2.5 x WVDC

Measure after 24±2 hour cooling period

HUMIDITY,

No mechanical damage.

Relative humidity: 90-95%

STEADY STATE:

Capacitance change: ±5.0% or 0.50pF max.

Temperature: 40°±2°C

Q>300 I.R.

≥ 1 G-Ohm

Test time: 500 +12/-0 Hours

Breakdown voltage: 2.5 x WVDC

Measure after 24±2 hour cooling period

HUMIDITY,

No mechanical damage.

Applied voltage: 1.5 VDC, 50 mA max.

LOW VOLTAGE:

Capacitance change: ±5.0% or 0.50pF max.

Relative humidity: 85±2% Temperature: 40°±2°C

Q>300 I.R. = 1 G-Ohm min.

Test time: 240 +12/-0 Hours

Breakdown voltage: 2.5 x WVDC

Measure after 24±2 hour cooling period

VIBRATION:

No mechanical damage.

Capacitance change: ±2.5% or 0.25pF

Cycle performed for 2 hours in each of three perpendicular directions

Q>1000 I.R.

≥ 10 G-Ohm

Frequency range 10Hz to 55 Hz to 10 Hz traversed

Breakdown voltage: 2.5 x WVDC

in 1 minute. Harmonic motion amplitude: 1.5mm

NPO

X7R

0 ± 30ppm /°C, -55 to 125°C

Q

>1,000 @ 1 MHz, Typical 10,000

>10 G

Ω @ 25°C,WVDC;

125°C IR is 10% of 25°C rating

2.5 X WVDC Min., 25°C, 50 mA max

1MHz ±50kHz, 1.0±0.2 VRMS, 25°C

Size 01005: 0.2 - 10 pF

Size 0201:

0.2 - 100 pF

Size 0402:

0.2 - 33 pF

Size 0603:

0.2 - 100 pF

Size 0805:

0.3 - 220 pF

Size 1111:

0.2 - 1000 pF

Size 2525:

1.0 - 2700 pF

Size 3838:

1.0 - 5100 pF

± 15%, -55 to 125°C

16VDC DF

≤ 3.5% @ 1 KHz, 25°C

10VDC DF

≤ 5.0% @ 1 KHz, 25°C

>500

ΩF* or 10 GΩ* @ 25°C,WVDC;

125°C IR is 10% of 25°C rating

* whichever is less

2.5 X WVDC Min., 25°C, 50 mA max

1KHz ±50Hz, 1.0±0.2 VRMS, 25°C

100 - 10,000 pF

TEMPERATURE COEFFICIENT:

QUALITY FACTOR / DF:

INSULATION RESISTANCE:

DIELECTRIC STRENGTH:

TEST PARAMETERS:

AVAILABLE CAPACITANCE: