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LPC11U34 Datasheet(PDF) 3 Page - NXP Semiconductors |
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LPC11U34 Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 76 page LPC11U3X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 2 — 25 November 2013 3 of 76 NXP Semiconductors LPC11U3x 32-bit ARM Cortex-M0 microcontroller Power profiles residing in boot ROM provide optimized performance and minimized power consumption for any given application through one simple function call. Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down. Processor wake-up from Deep-sleep and Power-down modes via reset, selectable GPIO pins, watchdog interrupt, or USB port activity. Processor wake-up from Deep power-down mode using one special function pin. Power-On Reset (POR). Brownout detect with up to four separate thresholds for interrupt and forced reset. Unique device serial number for identification. Single 3.3 V power supply (1.8 V to 3.6 V). Temperature range 40 C to +85 C. Available as LQFP64, LQFP48, TFBGA48, and HVQFN33 packages. 3. Applications 4. Ordering information Consumer peripherals Handheld scanners Medical USB audio devices Industrial control Table 1. Ordering information Type number Package Name Description Version LPC11U34FHN33/311 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC11U34FBD48/311 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm SOT313-2 LPC11U34FHN33/421 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC11U34FBD48/421 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm SOT313-2 LPC11U35FHN33/401 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC11U35FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm SOT313-2 LPC11U35FBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm SOT314-2 LPC11U35FHI33/501 HVQFN33 plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5 5 0.85 mm n/a LPC11U35FET48/501 TFBGA48 plastic thin fine-pitch ball grid array package; 48 balls; body 4.5 4.5 0.7 mm SOT1155-2 LPC11U36FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm SOT313-2 LPC11U36FBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm SOT314-2 LPC11U37FBD48/401 LQFP48 plastic low profile quad flat package; 48 leads; body 7 7 1.4 mm SOT313-2 LPC11U37HFBD64/401 LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm SOT314-2 LPC11U37FBD64/501 LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm SOT314-2 |
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