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LPC11U34 Datasheet(PDF) 3 Page - NXP Semiconductors

Part # LPC11U34
Description  32-bit ARM Cortex-M0 microcontroller up to 128 kB flash up to 12 kB SRAM and 4 kB EEPROM USB device USART
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC11U34 Datasheet(HTML) 3 Page - NXP Semiconductors

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LPC11U3X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 25 November 2013
3 of 76
NXP Semiconductors
LPC11U3x
32-bit ARM Cortex-M0 microcontroller
Power profiles residing in boot ROM provide optimized performance and minimized
power consumption for any given application through one simple function call.
Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep
power-down.
Processor wake-up from Deep-sleep and Power-down modes via reset, selectable
GPIO pins, watchdog interrupt, or USB port activity.
Processor wake-up from Deep power-down mode using one special function pin.
Power-On Reset (POR).
Brownout detect with up to four separate thresholds for interrupt and forced reset.
Unique device serial number for identification.
Single 3.3 V power supply (1.8 V to 3.6 V).
Temperature range
40 C to +85 C.
Available as LQFP64, LQFP48, TFBGA48, and HVQFN33 packages.
3.
Applications
4.
Ordering information
Consumer peripherals
Handheld scanners
Medical
USB audio devices
Industrial control
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC11U34FHN33/311
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7
 7  0.85 mm
n/a
LPC11U34FBD48/311
LQFP48
plastic low profile quad flat package; 48 leads; body 7
 7  1.4 mm
SOT313-2
LPC11U34FHN33/421
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7
 7  0.85 mm
n/a
LPC11U34FBD48/421
LQFP48
plastic low profile quad flat package; 48 leads; body 7
 7  1.4 mm
SOT313-2
LPC11U35FHN33/401
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 7
 7  0.85 mm
n/a
LPC11U35FBD48/401
LQFP48
plastic low profile quad flat package; 48 leads; body 7
 7  1.4 mm
SOT313-2
LPC11U35FBD64/401
LQFP64
plastic low profile quad flat package; 64 leads; body 10
 10  1.4 mm SOT314-2
LPC11U35FHI33/501
HVQFN33
plastic thermal enhanced very thin quad flat package; no leads; 33
terminals; body 5
 5  0.85 mm
n/a
LPC11U35FET48/501
TFBGA48
plastic thin fine-pitch ball grid array package; 48 balls; body 4.5
 4.5
 0.7 mm
SOT1155-2
LPC11U36FBD48/401
LQFP48
plastic low profile quad flat package; 48 leads; body 7
 7  1.4 mm
SOT313-2
LPC11U36FBD64/401
LQFP64
plastic low profile quad flat package; 64 leads; body 10
 10  1.4 mm SOT314-2
LPC11U37FBD48/401
LQFP48
plastic low profile quad flat package; 48 leads; body 7
 7  1.4 mm
SOT313-2
LPC11U37HFBD64/401
LQFP64
plastic low profile quad flat package; 64 leads; body 10
 10  1.4 mm SOT314-2
LPC11U37FBD64/501
LQFP64
plastic low profile quad flat package; 64 leads; body 10
 10  1.4 mm SOT314-2


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