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RC5025 Datasheet(PDF) 6 Page - Samsung semiconductor |
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RC5025 Datasheet(HTML) 6 Page - Samsung semiconductor |
6 / 40 page Recommended Soldering Conditions Since Chip resistors come into direct contact with melted solder during soldering, it is exposed to potential mechanical stress caused by the sudden temperature change. The chip resistors may also be subject to silver migration, and to contamination by the flux. Because of these factors, soldering technique is critical. •There are 3 soldering methods. - Flow(wave) soldering. - Reflow soldering. (Reflow soldering is broadly divided into the total heating method and local heating method.) - Iron soldering. •Features PCB solder Primary wave Secondary wave There are two types of soldering methods in flow(wave) soldering. One is single wave soldering, the other is a double waves soldering. However, double waves soldering is mainly used. This method is designed so that the continuous and multiple dipping processes by waves of solder having completely different primary and secondary characteristics and waveforms. With the primary wave, a comparatively strong jet flow is used to remove the flux gas and to solder. With the secondary wave, it is used to remove excessive solder. With the primary wave, the solder flows into a very small gap between components and air bubbles remaining on the soldered joint are removed. With the secondary wave, the peel back is used to prevent bridging. •Preheating If a chip component is heated suddenly during soldering, it may be cracked by the thermal shock caused by the temperature difference between the surface and the inside of the chip. To prevent this, a full preheating is necessary. In case of wave soldering, the temperature difference between solder and surface of the component is kept within 150℃. Also when cooling is done by dipping into solvent, care should be taken to keep the temperature difference within 150℃. •Standard Soldering Condition Soldering must be carried out without exceeding the approved soldering temperature and time shown within the shaded area of the right graph. An excessively long soldering time or high soldering temperature results in leaching of the outer terminations. When a PCB is warped, mechanical stress applied to the chip will be increased and might be a cause of chip crack, especially if there is big amount of solder on the chip. So, care should be taken not to use excessive amount of solder on the PCB. For the flow(wave) soldering, the solder amount can be controlled by land size. Soldering Methods Reflow Soldering Total Heating Local Heating Laser Wave Soldering Single Wave Double Waves Infrared Ray Iron Soldering Convection/Infrared Hot Air Hot Plate Optical Beam Air Heater < Flow Soldering> Abstract Flow(wave) Soldering Pre-heating 120 sec. min. Time(sec.) Soldering Temp.( ℃) Pre-heating Temp.( ℃) Gradual Cooling in the air 245 ±10℃ 5 sec. max. (Ⅰ)1206(3216) and below :150 ℃ max. △T |
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Similar Description - RC5025 |
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