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MCFT000130 Datasheet(PDF) 7 Page - List of Unclassifed Manufacturers |
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MCFT000130 Datasheet(HTML) 7 Page - List of Unclassifed Manufacturers |
7 / 10 page www.element14.com www.farnell.com www.newark.com Page <7> V1.0 18/07/12 Wire Wound Chip Inductor MCFT02 Wire Wound Chip Inductors / High SRF Type Electrical Performance Test Item Requirement Test Method Inductance Refer to standard electrical characteristic spec. HP4286 Q HP4286 SRF HP4287 DC Resistance RDC Micro-Ohm meter (Gom-801G) Rated Current IDC Applied the current to coils, The inductance change should be less than 10% to initial value Over Load Inductors shall have no evidence of electrical and mechanical damage Applied 2 times of rated allowed DC current to inductor for a period of 5 minutes Withstanding Voltage Inductors shall be no evidence of electrical and mechanical damage. AC voltage of 500 VAC applied between inductors terminal and case for 1 min. Insulation Resistance 1,000MΩ min. 100 VDC applied between inductor terminal and case 27 ±2%, ±3%, ±5%, ±10% 250 62 86 3.2 0.275 450 33 ±2%, ±3%, ±5%, ±10% 250 61 80 2.8 0.33 490 39 ±2%, ±3%, ±5%, ±10% 250 56 84 2.6 0.43 450 47 ±2%, ±3%, ±5%, ±10% 250 48 62 2.4 0.58 420 Item Requirement Test Method Vibration Appearance: No damage L change: within ±5% Q change: within ±10% Test device shall be soldered on the substrate Oscillation Frequency: 10 to 55 to 10Hz for 1 min. Amplitude: 1.5 mm Time: 2 hrs for each axis (X, Y &Z), total 6 hrs Resistance to Soldering Heat Solder Temperature: 260±5°C Immersion Time: 10±2 seconds Component Adhesion (Push Test) 1 lbs. For 0402 2 lbs. For 0603 3 lbs. For the rest The device should be soldered (260±5 for 10 seconds) to a tinned copper subs rate. A dynamiter force gauge should be applied to the side of the component. The device must with stand a minimum force of 2 or 4 pounds without a failure of adhesion on termination Drop No damage Dropping chip by each side and each corner. Drop 10 times in total Drop height: 100 cm Drop weight: 125 g Solderability 90% covered with solder Inductor shall be dipped in a melted solder bath at 245±5 for 3 seconds Resistance to Solvent No damage on appearance and marking MIL-STD-202F, Method 215D Mechanical Performance Test |
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