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LQP03TN1N9B04 Datasheet(PDF) 3 Page - Murata Manufacturing Co., Ltd. |
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LQP03TN1N9B04 Datasheet(HTML) 3 Page - Murata Manufacturing Co., Ltd. |
3 / 3 page 3 Data Sheet !Note: 1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering. 2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. http://www.murata.com/ 3 Inductors (Coils) > Chip Inductor (Chip Coil) > for High Frequency Film Type 2011.9.8 oThis data sheet is applied for CHIP INDUCTORS (CHIP COILS) used for General Electronics equipment for your design. Continued from the preceding page. Part Number Inductance Test Frequency Rated Current Max. of DC Resistance Q (min.) Test Frequency Self Resonance Frequency (min.) LQP03TN22NJ04 p 22nH ±5% 500MHz 70mA 2.55ohm 11 500MHz 2800MHz LQP03TN27NH04 p 27nH ±3% 500MHz 70mA 2.90ohm 11 500MHz 2500MHz LQP03TN27NJ04 p 27nH ±5% 500MHz 70mA 2.90ohm 11 500MHz 2500MHz LQP03TN33NJ04 p 33nH ±5% 300MHz 60mA 2.95ohm 8 300MHz 2000MHz LQP03TN39NJ04 p 39nH ±5% 300MHz 60mA 3.35ohm 8 300MHz 1800MHz LQP03TN47NJ04 p 47nH ±5% 300MHz 50mA 3.60ohm 8 300MHz 1600MHz LQP03TN56NJ04 p 56nH ±5% 300MHz 50mA 4.30ohm 8 300MHz 1400MHz Operating Temperature Range (Self-temperature rise is not included): -40 to +85°C Only for reflow soldering. c Q-Frequency Characteristics (Typ.) 100 1000 10000 20 40 60 80 0 Frequency (MHz) 1.5nH 3.9nH 6.8nH 10nH 15nH 27nH 56nH c Inductance-Frequency Characteristics (Typ.) 1 10 100 1000 100 1000 10000 Frequency (MHz) 1.5nH 3.9nH 6.8nH 10nH 15nH 27nH 56nH c !Caution/Notice !Caution (Rating) Do not use products beyond the rated current as this may create excessive heat. Notice Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin melting point is used. Please confirm the solderability of Tin plating termination chip before use. |
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