BZB84_SER_3

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 03 — 9 June 2009

4 of 14

NXP Semiconductors

BZB84 series

Dual Zener diodes

[1]

[2]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Soldering points at pins 1 and 2.

7.

Characteristics

[1]

Per device

total power dissipation

[2] -

300

mW

junction temperature

-

150

°C

ambient temperature

−55

+150

°C

storage temperature

−65

+150

°C

Table 5.

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per device; single diode loaded

thermal resistance from

junction to ambient

in free air

[1] -

-

417

K/W

thermal resistance from

junction to solder point

[2] -

-

100

K/W

Table 7.

Characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per diode

forward voltage

[1] -

-

0.9

V