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LMT87QDCKRQ1 Datasheet(PDF) 3 Page - Texas Instruments |
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LMT87QDCKRQ1 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 16 page LMT87, LMT87-Q1 www.ti.com SNIS170A – MARCH 2013 – REVISED JUNE 2013 ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT MIN MAX Supply Voltage −0.3 6 V Voltage at Output Pin −0.3 VDD + 0.5 V Output Current ±7 mA Input Current at any pin (2) 5 5 mA Storage Temperature −65 150 °C Maximum Junction Temperature (TJMAX) 150 °C Human Body Model 2500 V ESD Susceptibility (3) Machine Model 250 V Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.(4) (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not specific performance limits. For specifications and test conditions, see the Electrical Characteristics. The specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V), the current at that pin should be limited to 5 mA. (3) The human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. (4) Reflow temperature profiles are different for lead-free and non-lead-free packages. OPERATING RATINGS VALUE UNIT TMIN ≤ TA ≤ TMAX °C Specified Temperature Range −50 ≤ TA ≤ 150 °C Supply Voltage Range (VDD) 2.7 to 5.5 V Thermal Resistance ( θJA) (1) (2) (SOT) 415 °C/W (1) The junction to ambient thermal resistance ( θJA) is specified without a heat sink in still air. (2) Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance. Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LMT87 LMT87-Q1 |
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