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SI6467DQ Datasheet(PDF) 2 Page - Fairchild Semiconductor |
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SI6467DQ Datasheet(HTML) 2 Page - Fairchild Semiconductor |
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2 / 5 page  Si6467DQ Rev. A (W) Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = –250 µA –20 V ∆BVDSS ∆T J Breakdown Voltage Temperature Coefficient ID = –250 µA, Referenced to 25°C –11 mV/ °C IDSS Zero Gate Voltage Drain Current VDS = –16 V, VGS = 0 V –1 µA IGSSF Gate–Body Leakage, Forward VGS = –8 V, VDS = 0 V –100 nA IGSSR Gate–Body Leakage, Reverse VGS = 8 V VDS = 0 V 100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = –250 µA –0.4 –0.6 –1.5 V ∆VGS(th) ∆T J Gate Threshold Voltage Temperature Coefficient ID = –250 µA, Referenced to 25°C 2 mV/ °C RDS(on) Static Drain–Source On–Resistance VGS = –4.5 V, ID = –9.2 A VGS = –2.5 V, ID = –7.9 A VGS = –1.8 V, ID = –6.5 A VGS=–4.5 V, ID =–9.2 A, TJ=125 °C 9 11 14 12 12 15 21.5 18 m Ω ID(on) On–State Drain Current VGS = –4.5 V, VDS = –5 V –50 A gFS Forward Transconductance VDS = –5 V, ID = –9.2 A 54 S Dynamic Characteristics Ciss Input Capacitance 5878 pF Coss Output Capacitance 994 pF Crss Reverse Transfer Capacitance VDS = –10 V, V GS = 0 V, f = 1.0 MHz 559 pF Switching Characteristics (Note 2) td(on) Turn–On Delay Time 15 27 ns Tr Turn–On Rise Time 15 27 ns Td(off) Turn–Off Delay Time 210 336 ns tf Turn–Off Fall Time VDD = –10 V, ID = –1 A, VGS = –4.5 V, RGEN = 6 Ω 100 160 ns Qg Total Gate Charge 60 96 nC Qgs Gate–Source Charge 7 nC Qgd Gate–Drain Charge VDS = –10 V, ID = –9.2 A, VGS = –4.5 V 13 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current –1.2 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = –1.2 A (Note 2) –0.5 –1.2 V Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) RθJA is 96°C/W (steady state) when mounted on a 1 inch² copper pad on FR-4. b) RθJA is 208°C/W (steady state) when mounted on a minimum copper pad on FR-4. 2. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0% |
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